Inventor · disambiguated record
Dilan Seneviratne
Also filed as: SENEVIRATNE DILAN · Seneviratne Dilan Anuradha
39 granted patents·42 pending applications·36 citations·filing 2004–2024
96Inventor score
Top patents by PatentIndex Score
81 records- 0189US11935857B2Surface finishes with low RBTV for fine and mixed bump pitch architecturesINTEL CORP·Filed 2022·Granted Mar 19, 2024·1 cites·22 claims
- 0282US11081768B2Fabricating an RF filter on a semiconductor package using selective seedingINTEL CORP·Filed 2019·Granted Aug 3, 2021·2 cites·21 claims
- 0381US11488918B2Surface finishes with low rBTV for fine and mixed bump pitch architecturesINTEL CORP·Filed 2018·Granted Nov 1, 2022·3 cites·15 claims
- 0480US11393745B2Semiconductor packages with embedded interconnectsINTEL CORP·Filed 2017·Granted Jul 19, 2022·3 cites·18 claims
- 0577US12442979B2Optical waveguide formed within in a glass layerINTEL CORP·Filed 2021·Granted Oct 14, 2025·1 cites·25 claims
- 0676US10756161B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2018·Granted Aug 25, 2020·2 cites·16 claims
- 0776US9554472B2Panel with releasable coreINTEL CORP·Filed 2014·Granted Jan 24, 2017·2 cites·25 claims
- 0875US9320149B2Bumpless build-up layer package including a release layerINTEL CORP·Filed 2012·Granted Apr 19, 2016·4 cites·14 claims
- 0974US10204855B2Bendable and stretchable electronic devices and methodsINTEL CORP·Filed 2014·Granted Feb 12, 2019·3 cites·5 claims
- 1072US11737208B2Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2019·Granted Aug 22, 2023·1 cites·13 claims
- 1169US10546916B2Package-integrated vertical capacitors and methods of assembling sameINTEL CORP·Filed 2018·Granted Jan 28, 2020·1 cites·9 claims
- 1269US10068776B1Raster-planarized substrate interlayers and methods of planarizing sameINTEL CORP·Filed 2017·Granted Sep 4, 2018·1 cites·22 claims
- 1369US9646854B2Embedded circuit patterning feature selective electroless copper platingINTEL CORP·Filed 2014·Granted May 9, 2017·2 cites·6 claims
- 1469US2023345621A1Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2023·Application pending·0 cites
- 1568US11780210B2Glass dielectric layer with patterningINTEL CORP·Filed 2019·Granted Oct 10, 2023·1 cites·9 claims
- 1668US11081448B2Embedded die microelectronic device with molded componentINTEL CORP·Filed 2017·Granted Aug 3, 2021·1 cites·15 claims
- 1767US11605867B2Fabricating an RF filter on a semiconductor package using selective seedingINTEL CORP·Filed 2021·Granted Mar 14, 2023·0 cites·20 claims
- 1866US12087700B2Embedded die microelectronic device with molded componentINTEL CORP·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 1966US11942406B2Semiconductor packages with embedded interconnectsINTEL CORP·Filed 2022·Granted Mar 26, 2024·0 cites·20 claims
- 2066US9554468B2Panel with releasable coreINTEL CORP·Filed 2014·Granted Jan 24, 2017·2 cites·23 claims
- 2166US2023405976A1Glass dielectric layer with patterningINTEL CORP·Filed 2023·Application pending·0 cites
- 2264US10820437B2Flexible packaging for a wearable electronic deviceINTEL CORP·Filed 2016·Granted Oct 27, 2020·1 cites·9 claims
- 2363US11637171B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 25, 2023·0 cites·16 claims
- 2463US11296186B2Package-integrated vertical capacitors and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 5, 2022·0 cites·12 claims
- 2561US7909977B2Method of manufacturing a substrate for a microelectronic device, and substrate formed therebyINTEL CORP·Filed 2008·Granted Mar 22, 2011·1 cites·11 claims
- 2661US2025132239A1Porous liners for through-glass vias and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 2760US10798817B2Method for making a flexible wearable circuitINTEL CORP·Filed 2015·Granted Oct 6, 2020·1 cites·19 claims
- 2859US10043740B2Package with passivated interconnectsBOYAPATI SRI RANGA SAI·Filed 2016·Granted Aug 7, 2018·1 cites·20 claims
- 2959US2025391718A1Integrated circuit packages including substrates with reinforced glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 3058US11571876B2Dielectric film with pressure sensitive microcapsules of adhesion promoterINTEL CORP·Filed 2017·Granted Feb 7, 2023·0 cites·12 claims
- 3158US2025210506A1Passivation boundary defects for reduced leakage current capacitor dielectric materialsINTEL CORP·Filed 2023·Application pending·0 cites
- 3258US2025218962A1Technologies for a stack of components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 3358US2025218881A1Liquid-based method for embedding components in thick substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 3457US9788416B2Multilayer substrate for semiconductor packagingINTEL CORP·Filed 2014·Granted Oct 10, 2017·1 cites·23 claims
- 3557US2025279346A1High aspect ratio vias with low stress in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 3657US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3756US9451696B2Embedded architecture using resin coated copperSENEVIRATNE DILAN·Filed 2012·Granted Sep 20, 2016·1 cites·20 claims
- 3856US2024173953A1Method and apparatus for laminating a film on a substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 3956US2025218929A1Embedded deep trench capacitors in integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 4055US11670504B2Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passivesINTEL CORP·Filed 2019·Granted Jun 6, 2023·0 cites·23 claims
- 4155US2025218955A1Microelectronic structures including embedded glass patch with integrated capacitorINTEL CORP·Filed 2023·Application pending·0 cites
- 4255US2021260718A1Chemical mechanical polishing using fluorescence-based endpoint detectionINTEL CORP·Filed 2020·Application pending·0 cites
- 4355US2025379163A1Microelectronic assemblies having a glass layer substrate with integrated capacitorsINTEL CORP·Filed 2024·Application pending·0 cites
- 4454US2025309148A1Substrate with component embedded in a blind cavityINTEL CORP·Filed 2024·Application pending·0 cites
- 4554US2024113049A1Package substrate with open air gap structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 4653US10586715B2Embedded circuit patterning feature selective electrolessINTEL CORP·Filed 2017·Granted Mar 10, 2020·0 cites·11 claims
- 4753US2017202080A1Panel with releasable coreINTEL CORP·Filed 2017·Application pending·0 cites
- 4853US2024112999A1Layered glass assembly with pre-patterned electrically conductive interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 4953US2025300062A1Integrated circuit package comprising hollow filler-based build-up materialINTEL CORP·Filed 2024·Application pending·0 cites
- 5053US2014353019A1Formation of dielectric with smooth surfaceARORA DEEPAK·Filed 2013·Application pending·0 cites
Showing the top 50 of 81 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Dilan Seneviratne files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →