Inventor · disambiguated record
Dirk Tews
Also filed as: TEWS DIRK
7 granted patents·6 pending applications·5 citations·filing 2006–2023
72Inventor score
Files withATOTECH DEUTSCHLAND GMBH5ATOTECH DEUTSCHLAND GMBH & CO KG2TEWS DIRK2HUELSMANN THOMAS1LUETZOW NORBERT1
Top patents by PatentIndex Score
13 records- 0160US10477700B2Method for manufacturing a printed circuit boardATOTECH DEUTSCHLAND GMBH·Filed 2017·Granted Nov 12, 2019·1 cites·14 claims
- 0259US8192636B2Composition and method for improved adhesion of polymeric materials to copper alloy surfacesTEWS DIRK·Filed 2006·Granted Jun 5, 2012·3 cites·14 claims
- 0354US2025333847A1Composition for depositing a palladium coating on a substrateATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2023·Application pending·0 cites
- 0450US2015050422A1Method for promoting adhesion between dielectric substrates and metal layersATOTECH DEUTSCHLAND GMBH·Filed 2013·Application pending·0 cites
- 0547US8945298B2Non-etching non-resist adhesion composition and method of preparing a work pieceSPARING CHRISTIAN·Filed 2009·Granted Feb 3, 2015·1 cites·12 claims
- 0646US2023323542A1Compostion for depositing a palladium coating on a substrateATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2021·Application pending·0 cites
- 0743US11963308B2Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layerATOTECH DEUTSCHLAND GMBH·Filed 2019·Granted Apr 16, 2024·0 cites·20 claims
- 0841US9441304B2Aqueous composition for etching of copper and copper alloysATOTECH DEUTSCHLAND GMBH·Filed 2013·Granted Sep 13, 2016·0 cites·19 claims
- 0936US8758634B2Composition and method for micro etching of copper and copper alloysTEWS DIRK·Filed 2010·Granted Jun 24, 2014·0 cites·13 claims
- 1034US2017275767A1Composition and method for micro etching of copper and copper alloysATOTECH DEUTSCHLAND GMBH·Filed 2015·Application pending·0 cites
- 1131US9332652B2Process for etching a recessed structure filled with tin or a tin alloyWOOD NEAL·Filed 2012·Granted May 3, 2016·0 cites·8 claims
- 1230US2012118753A1Method of Manufacturing a Circuit Carrier Layer and a Use of Said Method for Manufacturing a Circuit CarrierLUETZOW NORBERT·Filed 2010·Application pending·0 cites
- 1330US2014141169A1Method for providing organic resist adhesion to a copper or copper alloy surfaceHUELSMANN THOMAS·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →