Inventor · disambiguated record
Dingying Xu
Also filed as: XU DINGYING · XU DINGYING D · XU DINGYING DAVID
29 granted patents·89 pending applications·133 citations·filing 2000–2025
94Inventor score
Top patents by PatentIndex Score
118 records- 0193US11676891B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0293US6492308B1Post chemical-mechanical planarization (CMP) cleaning compositionESC INC·Filed 2000·Granted Dec 10, 2002·96 cites·7 claims
- 0387US8466559B2Forming die backside coating structures with coreless packagesMANEPALLI RAHUL N·Filed 2010·Granted Jun 18, 2013·9 cites·17 claims
- 0486US11088062B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2017·Granted Aug 10, 2021·4 cites·14 claims
- 0586US9543197B2Package with dielectric or anisotropic conductive (ACF) buildup layerINTEL CORP·Filed 2012·Granted Jan 10, 2017·7 cites·23 claims
- 0681US9068067B2Flexible underfill compositions for enhanced reliabilityXU DINGYING·Filed 2010·Granted Jun 30, 2015·3 cites·10 claims
- 0780US12230564B2Package substrate z-disaggregation with liquid metal interconnectsINTEL CORP·Filed 2021·Granted Feb 18, 2025·1 cites·25 claims
- 0880US10168357B2Coated probe tips for plunger pins of an integrated circuit package test systemINTEL CORP·Filed 2015·Granted Jan 1, 2019·2 cites·2 claims
- 0977US12068222B2Dummy die structures of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Granted Aug 20, 2024·1 cites·15 claims
- 1076US12230563B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2022·Granted Feb 18, 2025·0 cites·21 claims
- 1175US2025149433A1New method to enable 30 microns pitch emib or belowINTEL CORP·Filed 2025·Application pending·0 cites
- 1273US8287996B2Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic dieXU DINGYING·Filed 2009·Granted Oct 16, 2012·5 cites·11 claims
- 1367US2024270929A1Capillary underfill formulations that include carbon nanotubes, containers, and methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 1465US11340258B2Probe pins with etched tips for electrical die testINTEL CORP·Filed 2020·Granted May 24, 2022·0 cites·18 claims
- 1565US7638867B2Microelectronic package having solder-filled through-viasINTEL CORP·Filed 2006·Granted Dec 29, 2009·3 cites·14 claims
- 1663US12494441B2BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling loadINTEL CORP·Filed 2022·Granted Dec 9, 2025·0 cites·25 claims
- 1762US9458283B2Flexible underfill compositions for enhanced reliabilityINTEL CORP·Filed 2015·Granted Oct 4, 2016·0 cites·20 claims
- 1861US2025105074A1Glass cores including protruding through glass vias and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 1959US2024264530A1Light responsive photoresists and methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 2059US2025386432A1Coaxial vias in glass core architecturesINTEL CORP·Filed 2024·Application pending·0 cites
- 2158US12341117B2Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substratesINTEL CORP·Filed 2021·Granted Jun 24, 2025·0 cites·25 claims
- 2258US2025218999A1Passive component assembly for thickness modification to match core thicknessINTEL CORP·Filed 2023·Application pending·0 cites
- 2358US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 2458US2025279384A1Methods and apparatus using polymer material to fill gaps between semiconductor diesINTEL CORP·Filed 2024·Application pending·0 cites
- 2557US12354883B2Omni directional interconnect with magnetic fillers in mold matrixINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·18 claims
- 2657US2025110295A1Polyethylene oxide-based optical adhesiveINTEL CORP·Filed 2023·Application pending·0 cites
- 2757US2025219028A1Deep trench capacitors in multi-core integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2857US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2957US2025149414A1Low z-height separable liquid metal based electrical interconnectINTEL CORP·Filed 2023·Application pending·0 cites
- 3057US2025220818A1Flow enhanced dummy structure to enable capillary flow based sidewall fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 3157US2025218964A1Technologies for connected components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 3257US2025218958A1Pedestals for semiconductor components embedded in package substrates and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 3357US2025218904A1Technologies for power and spacer components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 3457US2025218880A1Microelectronic assemblies with pillar-first conductive via formation in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3557US2025218960A1Methods and apparatus to embed semiconductor devices in cores of package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 3657US2025218926A1Microelectronic assemblies including cavity-less encapsulated diesINTEL CORP·Filed 2023·Application pending·0 cites
- 3756US11923312B2Patternable die attach materials and processes for patterningINTEL CORP·Filed 2019·Granted Mar 5, 2024·0 cites·12 claims
- 3856US2025273607A1Methods and architectures for shallow fiducial and metal defined pad designsINTEL CORP·Filed 2024·Application pending·0 cites
- 3956US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 4056US2025112085A1Apparatus and methods for capillary underfill of embedded devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 4156US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 4256US2025218957A1Methods and apparatus to embed a semiconductor device in a glass coreINTEL CORP·Filed 2023·Application pending·0 cites
- 4355US2025218906A1Reconstituted passive assemblies for embedding in thick coresINTEL CORP·Filed 2023·Application pending·0 cites
- 4455US2025106983A1Stiffener architectures for glass edge protectionINTEL CORP·Filed 2023·Application pending·0 cites
- 4555US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 4655US2025112164A1Controlling substrate bump heightINTEL CORP·Filed 2023·Application pending·0 cites
- 4755US2024243087A1Methods and apparatus to reduce variation in height of bumps after reflowINTEL CORP·Filed 2024·Application pending·0 cites
- 4855US2025192070A1Microelectronic assemblies with post-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 4954US10598696B2Probe pins with etched tips for electrical die testINTEL CORP·Filed 2016·Granted Mar 24, 2020·0 cites·20 claims
- 5054US2024222301A1Methods and apparatus for optical thermal treatment in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 118 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →