Inventor · disambiguated record
Di Zhan
Also filed as: ZHAN DI
1 granted patent·3 pending applications·0 citations·filing 2019–2021
3Inventor score
Files withWUHAN XINXIN SEMICONDUCTOR MFG4
Top patents by PatentIndex Score
4 records- 0139US2023163102A1Bonding structure and manufacturing method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Application pending·0 cites
- 0238US2024021559A1First chip and wafer bonding method and chip stacking structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Application pending·0 cites
- 0337US2023402415A1Method for manufacturing semiconductor device, and semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Application pending·0 cites
- 0435US11164834B2Wafer structure and method for manufacturing the same, and chip structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Nov 2, 2021·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →