Inventor · disambiguated record
Donald J. Beck
Also filed as: BECK DONALD J
8 granted patents·224 citations·filing 1997–2006
89Inventor score
Files withHARRIS CORP8
Top patents by PatentIndex Score
8 records- 0184US5894983AHigh frequency, low temperature thermosonic ribbon bonding process for system-level applicationsHARRIS CORP·Filed 1997·Granted Apr 20, 1999·91 cites·21 claims
- 0282US6700794B2Decoupling capacitor closely coupled with integrated circuitHARRIS CORP·Filed 2001·Granted Mar 2, 2004·28 cites·16 claims
- 0380US7705450B2Decoupling capacitor closely coupled with integrated circuitHARRIS CORP·Filed 2006·Granted Apr 27, 2010·8 cites·2 claims
- 0475US7145233B2Decoupling capacitor closely coupled with integrated circuitHARRIS CORP·Filed 2003·Granted Dec 5, 2006·18 cites·4 claims
- 0575US5907304ALightweight antenna subpanel having RF amplifier modules embedded in honeycomb support structure between radiation and signal distribution networksHARRIS CORP·Filed 1997·Granted May 25, 1999·61 cites·22 claims
- 0659US7642131B2Decoupling capacitor closely coupled with integrated circuitHARRIS CORP·Filed 2006·Granted Jan 5, 2010·1 cites·3 claims
- 0755US5938882AMethod for removing microelectronic circuits from substrates and tool used in removalHARRIS CORP·Filed 1998·Granted Aug 17, 1999·16 cites·13 claims
- 0827US6212765B1Method for removing microelectronic circuits from substrates and tool used in removalHARRIS CORP·Filed 1999·Granted Apr 10, 2001·1 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →