Inventor · disambiguated record
Dong Seok Chun
Also filed as: CHUN DONG SEOK
6 granted patents·1 pending application·297 citations·filing 1995–2018
86Inventor score
Files withLG SEMICON CO LTD3JUSUNG ENG CO LTD2HYUNDAI ELECTRONICS IND1HYUNDAI ELECTRONICS IND CO INC1
Top patents by PatentIndex Score
7 records- 0195US6407448B2Stackable ball grid array semiconductor package and fabrication method thereofHYUNDAI ELECTRONICS IND CO INC·Filed 2001·Granted Jun 18, 2002·156 cites·26 claims
- 0283US6291259B1Stackable ball grid array semiconductor package and fabrication method thereofHYUNDAI ELECTRONICS IND·Filed 1999·Granted Sep 18, 2001·71 cites·20 claims
- 0365US5933709ASemiconductor package and method for fabricating sameLG SEMICON CO LTD·Filed 1997·Granted Aug 3, 1999·34 cites·13 claims
- 0462US5821605ALOC semiconductor packageLG SEMICON CO LTD·Filed 1995·Granted Oct 13, 1998·27 cites·12 claims
- 0544US11417562B2Substrate supporting apparatusJUSUNG ENG CO LTD·Filed 2018·Granted Aug 16, 2022·0 cites·19 claims
- 0640US6066887ALOC semiconductor packageLG SEMICON CO LTD·Filed 1998·Granted May 23, 2000·9 cites·13 claims
- 0729US2018130674A1Apparatus and method for processing substrateJUSUNG ENG CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →