Inventor · disambiguated record
Dongseog Eun
Also filed as: EUN DONGSEOG
14 granted patents·3 pending applications·43 citations·filing 2013–2024
89Inventor score
Top patents by PatentIndex Score
17 records- 0194US11985820B2Semiconductor devices and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 0293US9230904B2Methods of forming a stack of electrodes and three-dimensional semiconductor devices fabricated therebyEUN DONGSEOG·Filed 2013·Granted Jan 5, 2016·20 cites·17 claims
- 0388US11177282B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 16, 2021·2 cites·20 claims
- 0487US9449870B2Methods of forming a stack of electrodes and three-dimensional semiconductor devices fabricated therebyEUN DONGSEOG·Filed 2015·Granted Sep 20, 2016·5 cites·26 claims
- 0585US11963361B2Integrated circuit device including vertical memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 16, 2024·2 cites·20 claims
- 0684US9558834B2Nonvolatile memory device and an erasing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 31, 2017·7 cites·20 claims
- 0779US10741574B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 11, 2020·2 cites·20 claims
- 0877US9812526B2Three-dimensional semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·3 cites·20 claims
- 0975US12376286B2Vertical non-volatile memory devices having a multi-stack structure with enhanced photolithographic alignment characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 1070US11641743B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 2, 2023·0 cites·20 claims
- 1169US2025393212A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1267US2023328990A1Semiconductor memory devices having stacked structures therein that support high integrationSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1367US2024224533A1Integrated circuit device including vertical memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1459US11895827B2Vertical non-volatile memory devices having a multi-stack structure with enhanced photolithographic alignment characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·21 claims
- 1558US11716844B2Semiconductor memory devices having stacked structures therein that support high integrationSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 1, 2023·0 cites·15 claims
- 1649US12219760B2Semiconductor chip and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 1740US10971518B2Three dimensional semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →