Inventor · disambiguated record
Dongyu Fan
Also filed as: FAN DONGYU
1 granted patent·11 pending applications·0 citations·filing 2021–2024
5Inventor score
Top patents by PatentIndex Score
12 records- 0158US2025357271A1Semiconductor package structure and manufacturing method thereof, and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0258US2025344412A1High bandwidth memory devices with multiple decksYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0357US2024387408A1Semiconductor devices, fabrication methods of semiconductor devices and semiconductor apparatusYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 0456US2025157906A1Fabricating semiconductor structures for semiconductor packagingYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 0555US12490432B2Method of fabricating a semiconductor device using laser annealingYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·19 claims
- 0655US2025253278A1Semiconductor devices, fabrication methods thereof, and memory systemsYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0754US2025157900A1Semiconductor packaging structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 0854US2024379497A1Memories and fabrication methods thereof, memory systems, and electronic devicesYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 0953US2024379578A1Semiconductor structure, dicing method thereof, and memoryYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1053US2025273545A1Semiconductor device and fabricating method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1153US2023422520A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1244US2024302277A1Pcr detector and method thereofINTEGRATED BIOSYSTEMS CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →