Inventor · disambiguated record
Donald S. Fritz
Also filed as: FRITZ DONALD · FRITZ DONALD S
10 granted patents·1 pending application·297 citations·filing 1994–2005
92Inventor score
Top patents by PatentIndex Score
11 records- 0194US7144756B1Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrateALTERA CORP·Filed 2005·Granted Dec 5, 2006·32 cites·13 claims
- 0291US6882041B1Thermally enhanced metal capped BGA packageALTERA CORP·Filed 2002·Granted Apr 19, 2005·73 cites·21 claims
- 0387US6909176B1Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrateALTERA CORP·Filed 2003·Granted Jun 21, 2005·41 cites·14 claims
- 0479US6734540B2Semiconductor package with stress inhibiting intermediate mounting substrateALTERA CORP·Filed 2001·Granted May 11, 2004·25 cites·29 claims
- 0575US7319051B2Thermally enhanced metal capped BGA packageALTERA CORP·Filed 2005·Granted Jan 15, 2008·6 cites·9 claims
- 0674US5757070AIntegrated circuit packageALTERA CORP·Filed 1995·Granted May 26, 1998·49 cites·57 claims
- 0772US5744383AIntegrated circuit package fabrication methodALTERA CORP·Filed 1995·Granted Apr 28, 1998·46 cites·17 claims
- 0854US6969636B1Semiconductor package with stress inhibiting intermediate mounting substrateALTERA CORP·Filed 2004·Granted Nov 29, 2005·5 cites·4 claims
- 0944US5554858ASegmented position sensing detector for reducing non-uniformly distributed stray light from a spot imageROBOTIC VISION SYSTEMS·Filed 1994·Granted Sep 10, 1996·13 cites·5 claims
- 1039US5723869AMultichannel position sensing detectorROBOTIC VISION SYSTEMS·Filed 1996·Granted Mar 3, 1998·7 cites·1 claims
- 1135US2002145207A1Method and structure for integrated circuit packageFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →