Inventor · disambiguated record
Dominik Hartmann
Also filed as: HARTMANN DOMINIK
4 granted patents·5 pending applications·10 citations·filing 2002–2022
65Inventor score
Files withBAUER SPEZIALTIEFBAU2ESEC TRADING SA2ESEC TRADING SA A SWISS CORP1GRAF MARCO1UNAXIS INT TRADING LTD1
Top patents by PatentIndex Score
9 records- 0153US11459724B2Method for producing a sealing base in the groundBAUER SPEZIALTIEFBAU·Filed 2019·Granted Oct 4, 2022·0 cites·10 claims
- 0253US2025050575A1A system and method for manufacturing one or more three-dimensional structuresVITO NV·Filed 2022·Application pending·0 cites
- 0351US7020954B2Apparatus for placing a semiconductor chip as a flipchip on a substrateESEC TRADING SA·Filed 2002·Granted Apr 4, 2006·5 cites·20 claims
- 0449US7284318B2Apparatus for mounting semiconductor chipsESEC TRADING SA·Filed 2002·Granted Oct 23, 2007·5 cites·12 claims
- 0546US2025305234A1Method and arrangement for producing a foundation element in the groundBAUER SPEZIALTIEFBAU·Filed 2022·Application pending·0 cites
- 0634US2006003096A1Apparatus and method for applying adhesive to a substrateUNAXIS INT TRADING LTD·Filed 2005·Application pending·0 cites
- 0728US9082816B2Method and apparatus for mounting semiconductor chipsGRAF MARCO·Filed 2012·Granted Jul 14, 2015·0 cites·2 claims
- 0828US2003201304A1Transport apparatus with a gripper for the transport of substratesFiled 2003·Application pending·0 cites
- 0926US2004105750A1Method for picking semiconductor chips from a foilESEC TRADING SA A SWISS CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →