Inventor · disambiguated record
Dongming He
Also filed as: HE DONGMING
18 granted patents·20 pending applications·189 citations·filing 2001–2024
92Inventor score
Files withQUALCOMM INC28INTEL CORP7DONGGUAN AMPEREX TECH LTD1NINGDE AMPEREX TECHNOLOGY LTD1UNIV ILLINOIS1
Top patents by PatentIndex Score
38 records- 0196US8963339B2Stacked multi-chip integrated circuit packageQUALCOMM INC·Filed 2012·Granted Feb 24, 2015·59 cites·28 claims
- 0294US7251389B2Embedded on-die laser source and optical interconnectINTEL CORP·Filed 2005·Granted Jul 31, 2007·46 cites·21 claims
- 0389US6573734B2Integrated thin film liquid conductivity sensorUNIV ILLINOIS·Filed 2001·Granted Jun 3, 2003·41 cites·21 claims
- 0485US11948909B2Package comprising spacers between integrated devicesQUALCOMM INC·Filed 2022·Granted Apr 2, 2024·1 cites·26 claims
- 0581US11557557B2Flip-chip flexible under bump metallization sizeQUALCOMM INC·Filed 2020·Granted Jan 17, 2023·1 cites·24 claims
- 0680US6989586B2Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systemsINTEL CORP·Filed 2003·Granted Jan 24, 2006·27 cites·38 claims
- 0779US9406649B2Stacked multi-chip integrated circuit packageQUALCOMM INC·Filed 2015·Granted Aug 2, 2016·3 cites·30 claims
- 0878US7517787B2C4 joint reliabilityINTEL CORP·Filed 2005·Granted Apr 14, 2009·8 cites·7 claims
- 0962US7626251B2Microelectronic die assembly having thermally conductive element at a backside thereof and method of making sameINTEL CORP·Filed 2006·Granted Dec 1, 2009·2 cites·9 claims
- 1060US2025273627A1Package comprising a base substrate and integrated devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1160US2025309078A1Semiconductor die having a die interconnect and a die level distribution (dld) metallization layer including a metal line and a metal pad having a width greater than the width of the metal line for improved signal path conductivity between the die interconnect and the metal padQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1260US2024319455A1Package comprising an optical integrated deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1360US2025279381A1Semiconductor die having a die level distribution (dld) metallization structure including a metal pad and a shorter via coupling the metal pad to a metal interconnect in the die for improved signal path conductivityQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1459US2025300112A1Integrated device comprising extended metallization region for pillar interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1559US2025300102A1Integrated device comprising metallization portionQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1658US12500188B2Flip-chip bumping metal layer and bump structureQUALCOMM INC·Filed 2023·Granted Dec 16, 2025·0 cites·27 claims
- 1758US2025273548A1Package comprising a bridge with spring padsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1857US9607777B2Separator and electrochemical deviceNINGDE AMPEREX TECHNOLOGY LTD·Filed 2014·Granted Mar 28, 2017·0 cites·18 claims
- 1957US7465651B2Integrated circuit packages with reduced stress on die and associated methodsINTEL CORP·Filed 2005·Granted Dec 16, 2008·1 cites·11 claims
- 2057US2025183211A1Stress mitigating pillar bumpsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2156US11694982B2Sidewall wetting barrier for conductive pillarsQUALCOMM INC·Filed 2021·Granted Jul 4, 2023·0 cites·30 claims
- 2256US11417622B2Flip-chip deviceQUALCOMM INC·Filed 2020·Granted Aug 16, 2022·0 cites·30 claims
- 2356US2024371736A1Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2456US2024421128A1Semiconductor device with multiple stacked passive devicesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2554US12113038B2Thermal compression flip chip bump for high performance and fine pitchQUALCOMM INC·Filed 2020·Granted Oct 8, 2024·0 cites·26 claims
- 2653US11721656B2Integrated device comprising pillar interconnect with cavityQUALCOMM INC·Filed 2021·Granted Aug 8, 2023·0 cites·25 claims
- 2753US2024006361A1Integrated device comprising pillar interconnects with variable widthsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2853US2024079352A1Integrated circuit (ic) packages employing capacitor interposer substrate with aligned external interconnects, and related fabrication methodsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2952US2023384367A1Bump structure for micro-bumped wafer probeQUALCOMM INC·Filed 2022·Application pending·0 cites
- 3052US2024055383A1Bump coplanarity for die-to-die and other applicationsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 3152US2024413112A1Integrated circuit device including multi-layer interconnect pillarQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3251US7656035B2C4 joint reliabilityINTEL CORP·Filed 2009·Granted Feb 2, 2010·0 cites·4 claims
- 3350US2024096845A1Circuit packages with bump interconnect polymer surround and method of manufactureQUALCOMM INC·Filed 2022·Application pending·0 cites
- 3449US11437335B2Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methodsQUALCOMM INC·Filed 2020·Granted Sep 6, 2022·0 cites·29 claims
- 3546US2009065931A1Packaged integrated circuit and method of forming thereofINTEL CORP·Filed 2007·Application pending·0 cites
- 3645US2023082120A1Integrated device comprising pillar interconnects with variable shapesQUALCOMM INC·Filed 2021·Application pending·0 cites
- 3737US2018331061A1Integrated device comprising bump on exposed redistribution interconnectQUALCOMM INC·Filed 2017·Application pending·0 cites
- 3833US2016190591A1Lithium-ion secondary battery and preparation method thereofDONGGUAN AMPEREX TECH LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →