Inventor · disambiguated record
Douglas W. Hendricks
Also filed as: HENDRICKS DOUGLAS W · HENDRICKS DOUGLAS WAYNE
15 granted patents·924 citations·filing 1987–1997
95Inventor score
Files withMOTOROLA INC15
Top patents by PatentIndex Score
15 records- 0198US5336931AAnchoring method for flow formed integrated circuit coversMOTOROLA INC·Filed 1993·Granted Aug 9, 1994·353 cites·12 claims
- 0297US5436028AMethod and apparatus for selectively applying solder paste to multiple types of printed circuit boardsMOTOROLA INC·Filed 1992·Granted Jul 25, 1995·71 cites·10 claims
- 0392US5439162ADirect chip attachment structure and methodMOTOROLA INC·Filed 1993·Granted Aug 8, 1995·162 cites·14 claims
- 0486US5444303AWire bond pad arrangement having improved pad densityMOTOROLA INC·Filed 1994·Granted Aug 22, 1995·90 cites·9 claims
- 0577US5323947AMethod and apparatus for use in forming pre-positioned solder bumps on a pad arrangementMOTOROLA INC·Filed 1993·Granted Jun 28, 1994·58 cites·19 claims
- 0676US5452656AApparatus for selectively applying solder paste to multiple types of printed circuit boardsMOTOROLA INC·Filed 1994·Granted Sep 26, 1995·37 cites·5 claims
- 0774US4889275AMethod for effecting solder interconnectsMOTOROLA INC·Filed 1988·Granted Dec 26, 1989·31 cites·8 claims
- 0873US5001038AProcess for photoimaging a three dimensional printed circuit substrateMOTOROLA INC·Filed 1987·Granted Mar 19, 1991·23 cites·3 claims
- 0971US5800723AProcess for fabricating flex circuits and product therebyMOTOROLA INC·Filed 1996·Granted Sep 1, 1998·36 cites·25 claims
- 1062US5598967AMethod and structure for attaching a circuit module to a circuit boardMOTOROLA INC·Filed 1995·Granted Feb 4, 1997·21 cites·10 claims
- 1156US5679498AMethod for producing high density multi-layer integrated circuit carriersMOTOROLA INC·Filed 1995·Granted Oct 21, 1997·22 cites·12 claims
- 1240US6069679ASelective call receiver having a display module with integrated circuits and method thereforMOTOROLA INC·Filed 1997·Granted May 30, 2000·8 cites·19 claims
- 1337US5164022AMethod and apparatus for applying solder fluxMOTOROLA INC·Filed 1991·Granted Nov 17, 1992·6 cites·9 claims
- 1434US5716760AMethod for plating a substrate to eliminate the use of a solder maskMOTOROLA INC·Filed 1997·Granted Feb 10, 1998·4 cites·30 claims
- 1532US5296046ASubliming solder flux compositionMOTOROLA INC·Filed 1993·Granted Mar 22, 1994·2 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Douglas W. Hendricks files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →