Inventor · disambiguated record
Douglas Heymann
Also filed as: HEYMANN DOUGLAS
13 granted patents·3 pending applications·40 citations·filing 2012–2024
88Inventor score
Files withINTEL CORP16
Top patents by PatentIndex Score
16 records- 0187US9551352B2Techniques for improved volumetric resistance blower apparatus, system and methodINTEL CORP·Filed 2013·Granted Jan 24, 2017·10 cites·14 claims
- 0287US9134757B2Electronic device having passive coolingINTEL CORP·Filed 2012·Granted Sep 15, 2015·12 cites·19 claims
- 0383US11250902B2Method and apparatus to reduce power consumption for refresh of memory devices on a memory moduleINTEL CORP·Filed 2019·Granted Feb 15, 2022·2 cites·17 claims
- 0477US9291170B2Blower assembly for electronic deviceINTEL CORP·Filed 2013·Granted Mar 22, 2016·4 cites·21 claims
- 0576US9152190B2Collapsible chimney for electronic deviceINTEL CORP·Filed 2012·Granted Oct 6, 2015·4 cites·15 claims
- 0672US9210991B2Apparatus and method for keeping mobile devices warm in cold climatesINTEL CORP·Filed 2014·Granted Dec 15, 2015·3 cites·17 claims
- 0768US10553974B2Thermal solution on latch for sodimm connectorINTEL CORP·Filed 2017·Granted Feb 4, 2020·2 cites·20 claims
- 0863US9309707B2Hinge assembly for electronic deviceINTEL CORP·Filed 2013·Granted Apr 12, 2016·2 cites·14 claims
- 0962US12315588B2Method and apparatus for improved memory module supply current surge responseINTEL CORP·Filed 2021·Granted May 27, 2025·0 cites·19 claims
- 1061US2024407127A1Airflow distribution to cool memory module shadowed by the processorINTEL CORP·Filed 2024·Application pending·0 cites
- 1160US9239060B2Blower assembly for electronic deviceINTEL CORP·Filed 2012·Granted Jan 19, 2016·1 cites·15 claims
- 1254US2024397628A1Conductive memory module notch and connector-to-motherboard pins for power or groundINTEL CORP·Filed 2024·Application pending·0 cites
- 1353US2024364037A1Camm connector pin with multi-spring (dual bend direction) leversINTEL CORP·Filed 2024·Application pending·0 cites
- 1440US10969974B2Power-based dynamic adjustment of memory module bandwidthINTEL CORP·Filed 2018·Granted Apr 6, 2021·0 cites·17 claims
- 1539US10529600B2Decoupling systemsINTEL CORP·Filed 2017·Granted Jan 7, 2020·0 cites·19 claims
- 1639US10211124B2Heat spreaders with staggered finsINTEL CORP·Filed 2017·Granted Feb 19, 2019·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →