Inventor · disambiguated record
Douglas E. Houston
Also filed as: ANTHONY THOMAS R · CLINE HARVEY E · HOUSTON DOUGLAS · HOUSTON DOUGLAS E
20 granted patents·546 citations·filing 1972–1986
96Inventor score
Top patents by PatentIndex Score
20 records- 0193US4392153ACooled semiconductor power module including structured strain buffers without dry interfacesGEN ELECTRIC·Filed 1978·Granted Jul 5, 1983·87 cites·23 claims
- 0292US4252263AMethod and apparatus for thermo-compression diffusion bondingGEN ELECTRIC·Filed 1980·Granted Feb 24, 1981·56 cites·7 claims
- 0391US4204628AMethod for thermo-compression diffusion bondingGEN ELECTRIC·Filed 1978·Granted May 27, 1980·45 cites·6 claims
- 0485US4060821AField controlled thyristor with buried gridGEN ELECTRIC·Filed 1976·Granted Nov 29, 1977·30 cites·5 claims
- 0584US4595428AMethod for producing high-aspect ratio hollow diffused regions in a semiconductor bodyGEN ELECTRIC·Filed 1984·Granted Jun 17, 1986·55 cites·4 claims
- 0683US3998662AMigration of fine lines for bodies of semiconductor materials having a (100) planar orientation of a major surfaceGEN ELECTRIC·Filed 1975·Granted Dec 21, 1976·41 cites·21 claims
- 0776US4527183ADrilled, diffused radiation detectorGEN ELECTRIC·Filed 1981·Granted Jul 2, 1985·34 cites·4 claims
- 0874US4032961AGate modulated bipolar transistorGEN ELECTRIC·Filed 1976·Granted Jun 28, 1977·20 cites·12 claims
- 0972US4315591AMethod for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device waferGEN ELECTRIC·Filed 1980·Granted Feb 16, 1982·35 cites·12 claims
- 1072US4257156AMethod for thermo-compression diffusion bonding each side of a substrateless semiconductor device wafer to respective structured copper strain buffersGEN ELECTRIC·Filed 1979·Granted Mar 24, 1981·30 cites·21 claims
- 1169US3984169AKeying for lever action connectorsHUBBELL INC HARVEY·Filed 1972·Granted Oct 5, 1976·20 cites·7 claims
- 1267US4385310AStructured copper strain bufferGEN ELECTRIC·Filed 1978·Granted May 24, 1983·24 cites·17 claims
- 1358US4720308AMethod for producing high-aspect ratio hollow diffused regions in a semiconductor body and diode produced therebyGEN ELECTRIC·Filed 1986·Granted Jan 19, 1988·23 cites·4 claims
- 1457US4570173AHigh-aspect-ratio hollow diffused regions in a semiconductor bodyGEN ELECTRIC·Filed 1983·Granted Feb 11, 1986·19 cites·6 claims
- 1544US4198247ASealant films for materials having high intrinsic vapor pressureGEN ELECTRIC·Filed 1978·Granted Apr 15, 1980·9 cites·10 claims
- 1644US4160679AMigration of fine liquid wires by thermal gradient zone melting through doped surfacesGEN ELECTRIC·Filed 1978·Granted Jul 10, 1979·9 cites·9 claims
- 1736US3979769AGate modulated bipolar transistorGEN ELECTRIC·Filed 1974·Granted Sep 7, 1976·3 cites·12 claims
- 1833US4170491ANear-surface thermal gradient enhancement with opaque coatingsGEN ELECTRIC·Filed 1978·Granted Oct 9, 1979·3 cites·10 claims
- 1932US4159213AStraight, uniform thermalmigration of fine linesGEN ELECTRIC·Filed 1978·Granted Jun 26, 1979·2 cites·10 claims
- 2030US4159916AThermal migration of fine lined cross-hatched patternsGEN ELECTRIC·Filed 1978·Granted Jul 3, 1979·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →