Inventor · disambiguated record
Do-Yun Hwang
Also filed as: HWANG DO YUN
4 granted patents·86 citations·filing 1996–2000
77Inventor score
Technology areasH10P
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0170US5840614AMethod of producing a semiconductor wafer using ultraviolet sensitive tapeSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Nov 24, 1998·40 cites·6 claims
- 0268US6193586B1Method and apparatus for grinding wafers using a grind chuck having high elastic modulusSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 27, 2001·35 cites·11 claims
- 0365US6629876B1Apparatus for grinding wafers using a grind chuck having a high elastic modulusSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 7, 2003·11 cites·9 claims
- 0427US6269281B1Back lapping in-line system for semiconductor device fabricationSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jul 31, 2001·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →