Inventor · disambiguated record
Dong Weon Hwang
Also filed as: HWANG DONG W · HWANG DONG WEON
27 granted patents·3 pending applications·354 citations·filing 1994–2024
95Inventor score
Top patents by PatentIndex Score
30 records- 0195US10466273B1Socket device for testing ICHWANG DONG WEON·Filed 2018·Granted Nov 5, 2019·25 cites·8 claims
- 0295US7025602B1Contact for electronic devicesPLASTRONICS SOCKET PARTNERS L·Filed 2005·Granted Apr 11, 2006·96 cites·15 claims
- 0393US11668744B2Contact and socket device for burning-in and testing semiconductor ICHICON CO LTD·Filed 2021·Granted Jun 6, 2023·4 cites·50 claims
- 0493US8808038B2Spring contact and a socket embedded with spring contactsHWANG DONG WEON·Filed 2010·Granted Aug 19, 2014·19 cites·22 claims
- 0587US11561241B2Spring contact and test socket with sameHICON CO LTD·Filed 2020·Granted Jan 24, 2023·2 cites·4 claims
- 0686US7601018B2BGA-type test and burn-in socket for integrated circuits (ICs)HWANG DONG WEON·Filed 2006·Granted Oct 13, 2009·16 cites·16 claims
- 0785US8715015B2Structure for a spring contactHWANG DONG WEON·Filed 2011·Granted May 6, 2014·17 cites·37 claims
- 0885US7874863B1Test and burn-in socket for integrated circuits (ICs)HWANG DONG WEON·Filed 2010·Granted Jan 25, 2011·6 cites·2 claims
- 0984US7828575B2Test and burn-in socket for integrated circuits (ICS)HWANG DONG WEON·Filed 2005·Granted Nov 9, 2010·8 cites·2 claims
- 1084US5381576AElectrical toothbrushFiled 1994·Granted Jan 17, 1995·104 cites·2 claims
- 1180US7918679B2Test and burn-in socket for integrated circuits (ICs)HWANG DONG WEON·Filed 2010·Granted Apr 5, 2011·4 cites·3 claims
- 1280US5442337ADevice for protection of digital multimeter from misinsertion of input plugH U KIM & ASSOCIATES·Filed 1994·Granted Aug 15, 1995·52 cites·13 claims
- 1372US11982688B2Spring contact and test socket with sameHICON CO LTD·Filed 2022·Granted May 14, 2024·0 cites·2 claims
- 1470US11486896B2Contact and test socket device for testing semiconductor deviceHWANG DONG WEON·Filed 2021·Granted Nov 1, 2022·0 cites·10 claims
- 1570US11486897B2Contact and test socket device for testing semiconductor deviceHWANG DONG WEON·Filed 2021·Granted Nov 1, 2022·0 cites·10 claims
- 1668US12392798B2Socket device for testing ICSHWANG DONG WEON·Filed 2023·Granted Aug 19, 2025·0 cites·8 claims
- 1762US10241132B2Socket apparatus for semiconductor device testHWANG DONG WEON·Filed 2015·Granted Mar 26, 2019·1 cites·20 claims
- 1860US10935572B2Contact and test socket device for testing semiconductor deviceHWANG DONG WEON·Filed 2017·Granted Mar 2, 2021·0 cites·15 claims
- 1957US2024230715A1SOCKET DEVICE FOR TESTING ICsHWANG DONG WEON·Filed 2024·Application pending·0 cites
- 2057US2024230716A1SOCKET DEVICE FOR TESTING ICsHWANG DONG WEON·Filed 2024·Application pending·0 cites
- 2156US2024069607A1Memory module socketHWANG DONG WEON·Filed 2023·Application pending·0 cites
- 2254US12061212B2Spring contact and socket having spring contact embedded thereinHWANG DONG WEON·Filed 2019·Granted Aug 13, 2024·0 cites·10 claims
- 2351US10761110B2Contact for testing semiconductor device, and test socket device thereforHWANG DONG WEON·Filed 2018·Granted Sep 1, 2020·0 cites·28 claims
- 2450US10971843B2BGA socket device for testing BGA ICHWANG DONG WEON·Filed 2019·Granted Apr 6, 2021·0 cites·17 claims
- 2548US11387584B1Contact pin for testing semiconductor IC for high speed signal, spring contact including same, and socket deviceHICON CO LTD·Filed 2021·Granted Jul 12, 2022·0 cites·22 claims
- 2647US10955438B2Contact and socket device for testing semiconductorHWANG DONG WEON·Filed 2018·Granted Mar 23, 2021·0 cites·16 claims
- 2741US9494616B2Socket device for testing semiconductor deviceHICON CO LTD·Filed 2013·Granted Nov 15, 2016·0 cites·7 claims
- 2840US10094852B2Spring contactHICON CO LTD·Filed 2013·Granted Oct 9, 2018·0 cites·7 claims
- 2940US9435853B2Socket device for an IC testHICON CO LTD·Filed 2012·Granted Sep 6, 2016·0 cites·15 claims
- 3039US12248001B2Lidless BGA socket apparatus for testing semiconductor deviceHICON CO LTD·Filed 2019·Granted Mar 11, 2025·0 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →