Inventor · disambiguated record
Don-Son Jiang
Also filed as: JIANG DON-SON
16 granted patents·8 pending applications·22 citations·filing 2008–2024
89Inventor score
Top patents by PatentIndex Score
24 records- 0196US11764188B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Sep 19, 2023·7 cites·10 claims
- 0294US11610850B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Mar 21, 2023·3 cites·10 claims
- 0394US11532528B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Dec 20, 2022·3 cites·18 claims
- 0491US12255182B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Mar 18, 2025·1 cites·14 claims
- 0590US12027484B2Electronic package and carrier thereof and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jul 2, 2024·2 cites·5 claims
- 0675US12255165B2Electronic package and carrier thereof and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Mar 18, 2025·0 cites·7 claims
- 0773US12107055B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·10 claims
- 0871US2025038088A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0968US2023361091A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1067US8304665B2Package substrate having landless conductive tracesCHANG CHIANG-CHENG·Filed 2008·Granted Nov 6, 2012·3 cites·12 claims
- 1164US12159821B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·24 claims
- 1263US12500159B2Electronic package having multi-chip package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·18 claims
- 1360US10115712B2Electronic moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 30, 2018·1 cites·7 claims
- 1460US9673140B2Package structure having a laminated release layer and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·1 cites·9 claims
- 1560US9646921B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 9, 2017·1 cites·7 claims
- 1659US11742296B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 29, 2023·0 cites·8 claims
- 1757US2025079255A1Electronic package and heat dissipation structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1855US11398429B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 1955US2025046670A1Electronic package and heat dissipation structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 2046US10163662B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·13 claims
- 2146US2024234272A9Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 2245US2022189900A1Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Application pending·0 cites
- 2342US2015102484A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2438US2020328142A1Package stack structure, method for fabricating the same, and carrier componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →