Inventor · disambiguated record
Dongchul Kang
Also filed as: KANG DONGCHUL
2 granted patents·5 pending applications·0 citations·filing 2017–2023
23Inventor score
Top patents by PatentIndex Score
7 records- 0165US2025293105A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0265US2025259859A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0361US2025287514A1Method for manufacturing electronic component deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0434US12404420B2Encapsulating material for compression molding and electronic part deviceSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Sep 2, 2025·0 cites·5 claims
- 0534US2020102454A1Resin composition and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0633US11854919B2Sealing composition and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Dec 26, 2023·0 cites·13 claims
- 0730US2021061986A1Epoxy resin composition and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →