Inventor · disambiguated record
Dong Yeong Kim
Also filed as: KIM DONG-YEONG
19 granted patents·5 pending applications·32 citations·filing 2014–2023
90Inventor score
Files withSAMSUNG ELECTRO MECH19SAMSUNG SDI CO LTD2KOREA ADVANCED INST SCI & TECH1MAX PLANCK GESELLSCHAFT1SAMSUNG SDS CO LTD1
Top patents by PatentIndex Score
24 records- 0198US11501922B2Multilayer electronic component for enhanced moisture resistance and bending strengthSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 15, 2022·6 cites·30 claims
- 0298US11183332B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 23, 2021·14 cites·27 claims
- 0397US11600443B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Mar 7, 2023·4 cites·21 claims
- 0497US11380488B2Multilayer electronic component for enhanced moisture resistance and bending strengthSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 5, 2022·4 cites·24 claims
- 0590US11862404B2Multilayer electronic component for enhanced moisture resistance and bending strengthSAMSUNG ELECTRO MECH·Filed 2022·Granted Jan 2, 2024·1 cites·24 claims
- 0690US11817271B2Multilayer electronic component including a silicon organic compound layer arranged between layers of an external electrodeSAMSUNG ELECTRO MECH·Filed 2022·Granted Nov 14, 2023·1 cites·14 claims
- 0783US12362100B2Multilayer electronic component for enhanced moisture resistance and bending strengthSAMSUNG ELECTRO MECH·Filed 2023·Granted Jul 15, 2025·0 cites·16 claims
- 0880US2024038449A1Multilayer electronic component including a silicon organic compound layer arranged between layers of an external electrodeSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0979US11721486B2Multilayer ceramic electronic component having specified thickness ratio for different portions of external electrodeSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 8, 2023·1 cites·20 claims
- 1074US12198863B2Multilayer ceramic electronic component having specified thickness ratio for different portions of external electrodeSAMSUNG ELECTRO MECH·Filed 2023·Granted Jan 14, 2025·0 cites·16 claims
- 1172US11837412B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Dec 5, 2023·0 cites·16 claims
- 1272US11056284B2Multi-layered ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 6, 2021·1 cites·8 claims
- 1368US11817259B2Multi-layered ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Nov 14, 2023·0 cites·14 claims
- 1468US11784002B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Oct 10, 2023·0 cites·15 claims
- 1564US11094466B2Multi-layered ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 17, 2021·0 cites·17 claims
- 1663US11335506B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted May 17, 2022·0 cites·12 claims
- 1763US11101074B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 24, 2021·0 cites·13 claims
- 1857US2025290199A1Method of forming a layer of a compoundMAX PLANCK GESELLSCHAFT·Filed 2021·Application pending·0 cites
- 1950US11996242B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2022·Granted May 28, 2024·0 cites·14 claims
- 2049US11011311B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2019·Granted May 18, 2021·0 cites·11 claims
- 2145US11496469B2Apparatus and method for registering biometric information, apparatus and method for biometric authenticationSAMSUNG SDS CO LTD·Filed 2020·Granted Nov 8, 2022·0 cites·14 claims
- 2245US2019280211A1Organic optoelectronic device and display deviceSAMSUNG SDI CO LTD·Filed 2017·Application pending·0 cites
- 2339US2019326518A1Organic optoelectronic device and display deviceSAMSUNG SDI CO LTD·Filed 2017·Application pending·0 cites
- 2438US2014289366A1Service providing method and system for instance hostingKOREA ADVANCED INST SCI & TECH·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →