Inventor · disambiguated record
Do Hyung Kim
Also filed as: KIM DO HYANG · KIM DO Y · KIM DO-HYUNG
368 granted patents·136 pending applications·2,443 citations·filing 1996–2025
99Inventor score
Files withSAMSUNG ELECTRONICS CO LTD125KOREA ELECTRONICS TELECOMM39KIM DO-HYUNG34ELECTRONICS & TELECOMMUNICATIONS RES INST33HYUNDAI MOBIS CO LTD26
Top patents by PatentIndex Score
504 records- 0198US11869879B2Semiconductor package using a coreless signal distribution structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Jan 9, 2024·3 cites·20 claims
- 0298US9780074B2Semiconductor package using a coreless signal distribution structureAMKOR TECHNOLOGY INC·Filed 2016·Granted Oct 3, 2017·24 cites·16 claims
- 0398US7679281B2Light emitting device having various color temperatureSEOUL SEMICONDUCTOR CO LTD·Filed 2008·Granted Mar 16, 2010·174 cites·18 claims
- 0497US11476233B2Semiconductor package using a coreless signal distribution structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Oct 18, 2022·3 cites·20 claims
- 0597US9391296B2Organic light emitting diode display device having a dam for controlling flow of encapsulantLG DISPLAY CO LTD·Filed 2014·Granted Jul 12, 2016·22 cites·8 claims
- 0697US7361940B2Leadframe and packaged light emitting diodeSEOUL SEMICONDUCTOR CO LTD·Filed 2005·Granted Apr 22, 2008·63 cites·19 claims
- 0796US11327592B2Display deviceLG DISPLAY CO LTD·Filed 2021·Granted May 10, 2022·3 cites·9 claims
- 0896US9607919B2Semiconductor device with thin redistribution layersAMKOR TECHNOLOGY INC·Filed 2014·Granted Mar 28, 2017·16 cites·22 claims
- 0996US9490231B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Nov 8, 2016·14 cites·20 claims
- 1096US9425200B2Semiconductor device including air gaps and method for fabricating the sameSK HYNIX INC·Filed 2014·Granted Aug 23, 2016·42 cites·21 claims
- 1196US7748873B2Side illumination lens and luminescent device using the sameSEOUL SEMICONDUCTOR CO LTD·Filed 2005·Granted Jul 6, 2010·38 cites·15 claims
- 1295US9818708B2Semiconductor device with thin redistribution layersAMKOR TECHNOLOGY INC·Filed 2017·Granted Nov 14, 2017·9 cites·20 claims
- 1395US8026589B1Reduced profile stackable semiconductor packageAMKOR TECHNOLOGY INC·Filed 2009·Granted Sep 27, 2011·67 cites·25 claims
- 1495US7737463B2Light emitting diode package with a heat sink support ring and having multiple molding resins, wherein secondary molding resin with higher hardness than primary molding resin and which covers primary molding resin that covers LED dieSEOUL SEMICONDUCTOR CO LTD·Filed 2008·Granted Jun 15, 2010·31 cites·11 claims
- 1595US7723852B1Stacked semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2008·Granted May 25, 2010·39 cites·18 claims
- 1695US7239718B2Apparatus and method for high-speed marker-free motion captureKOREA ELECTRONICS TELECOMM·Filed 2003·Granted Jul 3, 2007·116 cites·7 claims
- 1794US10903190B2Semiconductor package using a coreless signal distribution structureAMKOR TECHNOLOGY INC·Filed 2017·Granted Jan 26, 2021·7 cites·20 claims
- 1894US8345753B2Method, medium, and system visually compressing image dataSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 1, 2013·23 cites·21 claims
- 1994US8288793B2LED package having a lead frameKIM DO HYUNG·Filed 2011·Granted Oct 16, 2012·21 cites·20 claims
- 2094US8218629B2Encoding and/or decoding system, medium, and method with spatial prediction and spatial prediction compensation of image dataLEE SANG-JO·Filed 2007·Granted Jul 10, 2012·26 cites·44 claims
- 2194US7855395B2Light emitting diode package having multiple molding resins on a light emitting diode dieSEOUL SEMICONDUCTOR CO LTD·Filed 2005·Granted Dec 21, 2010·28 cites·19 claims
- 2293US11073928B2Display deviceLG DISPLAY CO LTD·Filed 2019·Granted Jul 27, 2021·5 cites·18 claims
- 2393US10861918B2Organic light emitting diode display deviceSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Dec 8, 2020·6 cites·19 claims
- 2493US10269744B2Semiconductor device with thin redistribution layersAMKOR TECHNOLOGY INC·Filed 2017·Granted Apr 23, 2019·6 cites·20 claims
- 2593US9568234B2RefrigeratorSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 14, 2017·6 cites·6 claims
- 2693US8890329B2Semiconductor deviceKIM DO HYUNG·Filed 2012·Granted Nov 18, 2014·18 cites·20 claims
- 2793US8796706B2Light emitting diode packageJUNG JUNG HWA·Filed 2010·Granted Aug 5, 2014·17 cites·18 claims
- 2893US7901113B2Side illumination lens and luminescent device using the sameSEOUL SEMICONDUCTOR CO LTD·Filed 2010·Granted Mar 8, 2011·13 cites·11 claims
- 2993US7276786B2Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mountedSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 2, 2007·32 cites·26 claims
- 3092US12016175B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 18, 2024·2 cites·20 claims
- 3192US10411014B2Semiconductor device including air gaps and method for fabricating the sameSK HYNIX INC·Filed 2016·Granted Sep 10, 2019·7 cites·10 claims
- 3292US10105943B2Lamination apparatus and lamination method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 23, 2018·8 cites·11 claims
- 3392US10056349B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 21, 2018·5 cites·20 claims
- 3492US10008393B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jun 26, 2018·7 cites·22 claims
- 3592US9786827B2Light emitting diode packageSEOUL SEMICONDUCTOR CO LTD·Filed 2016·Granted Oct 10, 2017·7 cites·19 claims
- 3692US9607419B2Method of fitting virtual item using human body model and system for providing fitting service of virtual itemELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2013·Granted Mar 28, 2017·19 cites·16 claims
- 3792US9257624B2Light emitting diode packageSEOUL SEMICONDUCTOR CO LTD·Filed 2015·Granted Feb 9, 2016·7 cites·13 claims
- 3892US9232221B2Method, medium, and system compressing and/or reconstructing image information with low complexitySAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 5, 2016·7 cites·20 claims
- 3992US9048391B2Light emitting diode packageSEOUL SEMICONDUCTOR CO LTD·Filed 2014·Granted Jun 2, 2015·10 cites·18 claims
- 4092US8014567B2Method and apparatus for recognizing gesture in image processing systemKOREA ELECTRONICS TELECOMM·Filed 2007·Granted Sep 6, 2011·47 cites·20 claims
- 4192US7939848B2LED packageSEOUL SEMICONDUCTOR CO LTD·Filed 2007·Granted May 10, 2011·24 cites·9 claims
- 4291US10410993B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Sep 10, 2019·4 cites·20 claims
- 4391US9690600B2Reconfigurable processor and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 27, 2017·15 cites·19 claims
- 4491US9472743B2Light emitting diode packageSEOUL SEMICONDUCTOR CO LTD·Filed 2015·Granted Oct 18, 2016·6 cites·15 claims
- 4591US8548201B2Apparatus and method for recognizing identifier of vehicleYOON HO SUB·Filed 2011·Granted Oct 1, 2013·38 cites·20 claims
- 4691US8192592B2Methods of forming a phase-change material layer including tellurium and methods of manufacturing a phase-change memory device using the sameKIM DO-HYUNG·Filed 2008·Granted Jun 5, 2012·12 cites·20 claims
- 4791US8067778B2Ultraviolet light emitting diode packageBAE JEONG SUK·Filed 2007·Granted Nov 29, 2011·25 cites·13 claims
- 4891US7642563B2LED package with metal PCBSEOUL SEMICONDUCTOR CO LTD·Filed 2008·Granted Jan 5, 2010·18 cites·18 claims
- 4990US11607988B2Lighting apparatus for vehicleHYUNDAI MOBIS CO LTD·Filed 2022·Granted Mar 21, 2023·2 cites·16 claims
- 5090US10364391B2Quantum dot, quantum dot film and LED package and display device including the sameLG DISPLAY CO LTD·Filed 2016·Granted Jul 30, 2019·7 cites·40 claims
Showing the top 50 of 504 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →