Inventor · disambiguated record
Dongok Kwak
Also filed as: KWAK DONGOK
5 granted patents·5 pending applications·6 citations·filing 2013–2024
67Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10
Top patents by PatentIndex Score
10 records- 0175US9437518B2Semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 6, 2016·5 cites·19 claims
- 0271US11251169B2Method of fabricating semiconductor package and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 15, 2022·1 cites·17 claims
- 0366US11791321B2Method of fabricating semiconductor package and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·19 claims
- 0461US2025349699A1Wiring substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0559US2025191983A1Electronic component packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0653US2024153856A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0752US2025201755A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0850US2024079380A1Stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0947US11315849B2Semiconductor package having stiffenerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 1045US12046546B2Package substrate and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →