Inventor · disambiguated record
Donguk Kwon
Also filed as: KWON DONGUK · KWON DONGUK ADITYA KUMAR
6 granted patents·8 pending applications·2 citations·filing 2021–2025
68Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD14
Top patents by PatentIndex Score
14 records- 0187US11676904B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0274US2025372500A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0371US12272652B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 0470US2025210533A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0562US12406917B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·10 claims
- 0656US2025167015A1Apparatus for manufacturing semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0754US2025174596A1Method of manufacturing semiconductor package and apparatus for manufacturing semiconductor package used thereforSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0853US2024170448A1Semiconductor package manufacturing method and a bonding device for manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0951US2024321823A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1048US12288745B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 1148US11749592B2Package-on-package type semiconductor package including a lower semiconductor package and an upper semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 1247US12463122B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 1347US2024049400A1Solder reflow apparatus and method of manufacturing an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1446US2023132054A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →