Inventor · disambiguated record
Doo Hwan Lee
Also filed as: LEE DOO H · LEE DOO-HWAN
84 granted patents·44 pending applications·456 citations·filing 1996–2021
99Inventor score
Files withSAMSUNG ELECTRO MECH62SAMSUNG ELECTRONICS CO LTD21LEE HYUN-CHUL9SAMSUNG SDI CO LTD9LEE DOO HWAN8
Top patents by PatentIndex Score
128 records- 0198US7282394B2Printed circuit board including embedded chips and method of fabricating the same using platingSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 16, 2007·114 cites·6 claims
- 0294US9462697B2Electronic component embedded substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 4, 2016·13 cites·18 claims
- 0393US8633397B2Method of processing cavity of core substrateJEONG JIN-SOO·Filed 2010·Granted Jan 21, 2014·40 cites·11 claims
- 0493US7886433B2Method of manufacturing a component-embedded PCBSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 15, 2011·29 cites·7 claims
- 0592US7697301B2Printed circuit board having embedded electronic components and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Apr 13, 2010·21 cites·8 claims
- 0691US9307632B2Multilayered substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 5, 2016·14 cites·21 claims
- 0791US8889078B2Porous oxide catalyst and method of preparing the porous oxide catalystJI SANG-MIN·Filed 2011·Granted Nov 18, 2014·24 cites·22 claims
- 0889US10903170B2Substrate having embedded interconnect structureSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 26, 2021·6 cites·31 claims
- 0989US8633131B2Mesoporous oxide-catalyst complex and method of preparing the mesoporous oxide-catalyst complexLEE DOO-HWAN·Filed 2010·Granted Jan 21, 2014·10 cites·25 claims
- 1089US8339796B2Embedded printed circuit board and method of manufacturing the sameLEE SANG CHUL·Filed 2010·Granted Dec 25, 2012·10 cites·4 claims
- 1188US9859222B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 2, 2018·6 cites·22 claims
- 1288US7947906B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted May 24, 2011·19 cites·15 claims
- 1386US10818621B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 27, 2020·5 cites·7 claims
- 1486US10643919B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 5, 2020·7 cites·20 claims
- 1586US7485569B2Printed circuit board including embedded chips and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Feb 3, 2009·13 cites·10 claims
- 1685US9881873B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 30, 2018·5 cites·13 claims
- 1785US8284562B2Electro device embedded printed circuit board and manufacturing method thereofLEE DOO-HWAN·Filed 2010·Granted Oct 9, 2012·10 cites·12 claims
- 1884US10566289B2Fan-out semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 18, 2020·4 cites·36 claims
- 1983US10091711B2Network searching by device supporting multiple communication methodsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 2, 2018·6 cites·9 claims
- 2083US9929100B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Mar 27, 2018·5 cites·22 claims
- 2182US11043441B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 22, 2021·3 cites·28 claims
- 2282US10886230B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 5, 2021·3 cites·20 claims
- 2382US10332855B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 25, 2019·6 cites·22 claims
- 2481US10600748B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 24, 2020·3 cites·33 claims
- 2581US8692391B2Embedded ball grid array substrate and manufacturing method thereofJEONG TAE SUNG·Filed 2010·Granted Apr 8, 2014·6 cites·3 claims
- 2678US9532397B2Method for providing communication service and electronic device thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 27, 2016·4 cites·18 claims
- 2777US10276467B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 30, 2019·3 cites·31 claims
- 2876US9788433B2Circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 10, 2017·2 cites·8 claims
- 2976US9420683B2Substrate embedding passive elementSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 16, 2016·4 cites·8 claims
- 3075US9543076B2Electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Jan 10, 2017·2 cites·12 claims
- 3174US9526177B2Printed circuit board including electronic component embedded therein and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 20, 2016·3 cites·10 claims
- 3274US8067332B2Methanation catalyst, and carbon monoxide removing system, fuel processor, and fuel cell including the sameLEE HYUN-CHUL·Filed 2007·Granted Nov 29, 2011·3 cites·33 claims
- 3374US8057560B2Fuel processor having movable burner, method of operating the same, and fuel cell system having the sameLEE HYUN-CHUL·Filed 2007·Granted Nov 15, 2011·2 cites·16 claims
- 3473US9087837B2Semiconductor package and method of manufacturing the sameLEE DOO HWAN·Filed 2012·Granted Jul 21, 2015·2 cites·8 claims
- 3573US8881382B2Embedded printed circuit board and method of manufacturing the sameLEE SANG CHUL·Filed 2011·Granted Nov 11, 2014·3 cites·8 claims
- 3672US7833934B2Hydrocarbon reforming catalyst, method of preparing the same and fuel processor including the sameSAMSUNG SDI CO LTD·Filed 2006·Granted Nov 16, 2010·1 cites·18 claims
- 3771US11011485B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 18, 2021·1 cites·20 claims
- 3871US8780572B2Printed circuit board having electronic componentLEE DOO HWAN·Filed 2010·Granted Jul 15, 2014·3 cites·3 claims
- 3970US8328885B2Fuel reformer burner of fuel cell systemLEE HYUN-CHUL·Filed 2009·Granted Dec 11, 2012·2 cites·7 claims
- 4070US8298984B2Non-pyrophoric catalyst for water-gas shift reaction and method of preparing the sameLEE HYUN-CHUL·Filed 2008·Granted Oct 30, 2012·2 cites·8 claims
- 4169US7740811B2Hydrogen generator having double burners and method of operating the sameSAMSUNG SDI CO LTD·Filed 2006·Granted Jun 22, 2010·1 cites·15 claims
- 4268US10892227B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 12, 2021·1 cites·19 claims
- 4368US10224288B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 5, 2019·1 cites·8 claims
- 4468US9516740B2Electronic component embedded substrate and method for manufacturing electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 6, 2016·3 cites·31 claims
- 4568US8057577B2Desulfurizer for fuel gas for fuel cell and desulfurization method using the sameLEE DOO-HWAN·Filed 2007·Granted Nov 15, 2011·1 cites·18 claims
- 4667US11011482B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 18, 2021·0 cites·15 claims
- 4767US8871569B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 28, 2014·1 cites·20 claims
- 4867US8633132B2Hydrocarbon reforming catalyst, method of preparing the same and fuel cell including the hydrocarbon reforming catalystLEE HYUN-CHUL·Filed 2009·Granted Jan 21, 2014·1 cites·18 claims
- 4966US11476215B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 18, 2022·0 cites·20 claims
- 5064US10015884B2Printed circuit board including embedded electronic component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 3, 2018·1 cites·7 claims
Showing the top 50 of 128 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →