Inventor · disambiguated record
Doohwan Lee
Also filed as: LEE DOOHWAN
38 granted patents·20 pending applications·41 citations·filing 2001–2025
95Inventor score
Files withSAMSUNG ELECTRONICS CO LTD31NIPPON TELEGRAPH & TELEPHONE18ANYPOINT MEDIA CO LTD2SAMSUNG SDI CO LTD2HANBIT INFORMATION & COMM CO1
Top patents by PatentIndex Score
58 records- 0194US12205939B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 21, 2025·2 cites·18 claims
- 0293US11289456B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 29, 2022·3 cites·20 claims
- 0392US11735532B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 22, 2023·3 cites·14 claims
- 0492US11202211B2OAM multiplexing communication system and OAM multiplexing communication methodNIPPON TELEGRAPH & TELEPHONE·Filed 2018·Granted Dec 14, 2021·10 cites·10 claims
- 0586US11355445B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 7, 2022·2 cites·20 claims
- 0685US11139867B2Antenna displacement correction method and device for OAM multiplexing communication systemNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Granted Oct 5, 2021·5 cites·5 claims
- 0784US11228363B2OAM multiplexing communication system and inter-mode interference elimination methodNIPPON TELEGRAPH & TELEPHONE·Filed 2018·Granted Jan 18, 2022·5 cites·9 claims
- 0878US11444706B2Antenna module including communication module capable of determining abnormality of transmission or reception pathSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 13, 2022·3 cites·14 claims
- 0977US2025192131A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1076US12388046B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 12, 2025·1 cites·15 claims
- 1175US12315822B2Methods of manufacturing a fan-out panel level semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted May 27, 2025·0 cites·15 claims
- 1275US11127646B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 21, 2021·2 cites·20 claims
- 1375US2024312959A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1472US7758984B2Shift reactor, fuel cell system employing the same, and operating method of the sameSAMSUNG SDI CO LTD·Filed 2006·Granted Jul 20, 2010·2 cites·17 claims
- 1569US12015014B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·17 claims
- 1669US2025247058A1Electronic device comprising power amplifier, and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1767US10873376B2OAM multiplexing communication system, OAM multiplexing transmission device, OAM multiplexing receiving device, and OAM multiplexing communication methodNIPPON TELEGRAPH & TELEPHONE·Filed 2018·Granted Dec 22, 2020·1 cites·8 claims
- 1866US12283446B2Switch and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 1966US12243791B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·19 claims
- 2065US11721577B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 8, 2023·0 cites·20 claims
- 2164US11901301B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·19 claims
- 2263US2023234031A1Catalyst structure having a core-shell structure with a controlled surface morphology and preparation method thereofUNIV SEOUL IND COOP FOUND·Filed 2023·Application pending·0 cites
- 2362US12453107B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 2462US11201397B2Circuit and wireless deviceNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Granted Dec 14, 2021·1 cites·7 claims
- 2560US11791230B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 2660US11302572B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·17 claims
- 2758US2025324137A1Method for providing advertisement for linear media serviceANYPOINT MEDIA CO LTD·Filed 2025·Application pending·0 cites
- 2857US2024235586A9Electronic device including couplerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2955US11342239B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 24, 2022·0 cites·15 claims
- 3054US11962341B2Electronic device and method for wireless communicationSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·15 claims
- 3154US2023115073A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3253US11942458B2Semiconductor package including a through-electrode penetrating a molding partSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·20 claims
- 3353US2023060618A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3452US2023223353A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3547US2007037022A1Startup method of fuel cell systemSAMSUNG SDI CO LTD·Filed 2006·Application pending·0 cites
- 3646US11323165B2Wireless communication device and wireless communication methodNIPPON TELEGRAPH & TELEPHONE·Filed 2018·Granted May 3, 2022·0 cites·6 claims
- 3746US11158581B2Semiconductor package having semiconductor chip between first and second redistribution layersSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·16 claims
- 3846US11121069B2Semiconductor package including capping pad having crystal grain of different sizeSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
- 3944US11811143B2Oam multiplexing communication system and inter-mode interference elimination methodNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Granted Nov 7, 2023·0 cites·10 claims
- 4044US11581263B2Semiconductor package, and package on package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 4144US11411325B2OAM multiplexing communication system and OAM multiplexing communication methodNIPPON TELEGRAPH & TELEPHONE·Filed 2018·Granted Aug 9, 2022·0 cites·9 claims
- 4244US11043446B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·18 claims
- 4344US2025141474A1Transmission apparatusNIPPON TELEGRAPH & TELEPHONE·Filed 2022·Application pending·0 cites
- 4443US11676915B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·18 claims
- 4543US11018749B2OAM multiplexing communication system and inter-mode interference compensation methodNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Granted May 25, 2021·0 cites·6 claims
- 4643US2024047843A1WaveguideNIPPON TELEGRAPH & TELEPHONE·Filed 2020·Application pending·0 cites
- 4743US2023412243A1Reception apparatus, and reception methodNIPPON TELEGRAPH & TELEPHONE·Filed 2020·Application pending·0 cites
- 4843US2024047841A1Butler matrix circuitNIPPON TELEGRAPH & TELEPHONE·Filed 2020·Application pending·0 cites
- 4943US2024039137A1WaveguideNIPPON TELEGRAPH & TELEPHONE·Filed 2020·Application pending·0 cites
- 5042US2024333345A1Radio communication system, transmission apparatus and reception apparatusNIPPON TELEGRAPH & TELEPHONE·Filed 2021·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →