Inventor · disambiguated record
Do Youn Lim
Also filed as: LIM DO YOUN
7 granted patents·2 pending applications·3 citations·filing 2017–2024
71Inventor score
Technology areasH10P
Files withSEMES CO LTD9
Top patents by PatentIndex Score
9 records- 0178US11495467B2Method and apparatus for etching thin layerSEMES CO LTD·Filed 2020·Granted Nov 8, 2022·1 cites·20 claims
- 0270US10529594B2Apparatus and method for treating substrateSEMES CO LTD·Filed 2017·Granted Jan 7, 2020·2 cites·23 claims
- 0359US12390842B2Supporting structure, apparatus for supporting substrate and facility for processing substrateSEMES CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 0457US2025210395A1Substrate processing apparatus including substrate support unitSEMES CO LTD·Filed 2024·Application pending·0 cites
- 0554US12322614B2Wafer expander for uniformly expanding gap between dies, and die supplying module and die bonding equipment including sameSEMES CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·9 claims
- 0653US12427446B2Liquid supplying unit and liquid supplying methodSEMES CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·14 claims
- 0753US12227373B2Article transport vehicle, rail assembly, and article transport system including the sameSEMES CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·18 claims
- 0847US2023207378A1Lift pin assembly and substrate processing apparatus having sameSEMES CO LTD·Filed 2022·Application pending·0 cites
- 0941US12334381B2Guide unit, transfer assembly and die bonding apparatus including the sameSEMES CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →