Inventor · disambiguated record
Dong Soon Lim
Also filed as: LIM DONG SOON
13 granted patents·3 pending applications·18 citations·filing 2011–2024
87Inventor score
Top patents by PatentIndex Score
16 records- 0196US11456284B2Microelectronic device assemblies and packages and related methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·5 cites·18 claims
- 0296US11362070B2Microelectronic device assemblies and packages including multiple device stacks and related methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 14, 2022·5 cites·31 claims
- 0391US12021668B2Equalization for pulse-amplitude modulationMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 25, 2024·2 cites·43 claims
- 0485US11177222B2Semiconductor packages and associated methods with antennas and EMI isolation shieldsMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 16, 2021·3 cites·20 claims
- 0584US11894099B2Programmable memory timingMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 6, 2024·1 cites·39 claims
- 0679US2025038127A1Semiconductor packages and associated methods with antennas and emi isolation shieldsLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 0775US12176061B2Programmable memory timingMICRON TECHNOLOGY INC·Filed 2024·Granted Dec 24, 2024·0 cites·20 claims
- 0872US12148711B2Semiconductor packages and associated methods with antennas and EMI isolation shieldsLODESTAR LICENSING GROUP LLC·Filed 2021·Granted Nov 19, 2024·0 cites·17 claims
- 0971US11948921B2Methods of forming stacked semiconductors die assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 2, 2024·0 cites·16 claims
- 1071US11410973B2Microelectronic device assemblies and packages and related methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·24 claims
- 1170US11393794B2Microelectronic device assemblies and packages including surface mount componentsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 19, 2022·0 cites·20 claims
- 1270US2024323062A1Equalization for Pulse-Amplitude ModulationMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1365US9009381B2USB connector for wireless communication deviceKIM JUNG-MIN·Filed 2011·Granted Apr 14, 2015·2 cites·5 claims
- 1460US12199068B2Methods of forming microelectronic device assemblies and packagesMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 14, 2025·0 cites·8 claims
- 1560US11961825B2Microelectronic device assemblies and packages including multiple device stacks and related methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 1636US2020075548A1Interconnects for a multi-die packageMICRON TECHNOLOGY INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →