Inventor · disambiguated record
Donald G. Mcbride
Also filed as: MCBRIDE DONALD G · MCBRIDE DONALD GENE
28 granted patents·1,088 citations·filing 1975–1997
98Inventor score
Files withIBM26
Top patents by PatentIndex Score
28 records- 0196US4766670AFull panel electronic packaging structure and method of making sameIBM·Filed 1987·Granted Aug 30, 1988·178 cites·6 claims
- 0295US5374454AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1993·Granted Dec 20, 1994·71 cites·39 claims
- 0394US4987100AFlexible carrier for an electronic deviceIBM·Filed 1989·Granted Jan 22, 1991·133 cites·11 claims
- 0491US4480288AMulti-layer flexible film moduleIBM·Filed 1982·Granted Oct 30, 1984·79 cites·2 claims
- 0589US4231154AElectronic package assembly methodIBM·Filed 1979·Granted Nov 4, 1980·67 cites·10 claims
- 0688US4681654AFlexible film semiconductor chip carrierIBM·Filed 1986·Granted Jul 21, 1987·116 cites·19 claims
- 0787US4855867AFull panel electronic packaging structureIBM·Filed 1988·Granted Aug 8, 1989·84 cites·8 claims
- 0878US4937707AFlexible carrier for an electronic deviceIBM·Filed 1988·Granted Jun 26, 1990·51 cites·8 claims
- 0973US4517051AMulti-layer flexible film moduleIBM·Filed 1984·Granted May 14, 1985·33 cites·6 claims
- 1072US5800858AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1996·Granted Sep 1, 1998·20 cites·7 claims
- 1170US4639380AProcess for preparing a substrate for subsequent electroless deposition of a metalIBM·Filed 1985·Granted Jan 27, 1987·29 cites·20 claims
- 1269US5109601AMethod of marking a thin film packageIBM·Filed 1990·Granted May 5, 1992·41 cites·7 claims
- 1364US4707378AMethod and apparatus for controlling the organic contamination level in an electroless plating bathIBM·Filed 1986·Granted Nov 17, 1987·22 cites·10 claims
- 1464US4692346AMethod and apparatus for controlling the surface chemistry on objects plated in an electroless plating bathIBM·Filed 1986·Granted Sep 8, 1987·23 cites·10 claims
- 1564US4652345AMethod of depositing a metal from an electroless plating solutionIBM·Filed 1983·Granted Mar 24, 1987·20 cites·19 claims
- 1658US5709906AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1995·Granted Jan 20, 1998·12 cites·33 claims
- 1754US4554184AMethod for plating from an electroless plating bathIBM·Filed 1984·Granted Nov 19, 1985·13 cites·19 claims
- 1850US5874154AStructure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive patternIBM·Filed 1996·Granted Feb 23, 1999·9 cites·7 claims
- 1948US4421608AMethod for stripping peel apart conductive structuresIBM·Filed 1982·Granted Dec 20, 1983·9 cites·8 claims
- 2046US5854093ADirect attachment of silicon chip to circuit carrierFiled 1997·Granted Dec 29, 1998·11 cites·5 claims
- 2146US5294259AFluid treatment deviceIBM·Filed 1992·Granted Mar 15, 1994·11 cites·22 claims
- 2244US4431685ADecreasing plated metal defectsIBM·Filed 1982·Granted Feb 14, 1984·7 cites·16 claims
- 2344US4026759AMethod of making ingrown lead frame with strain reliefIBM·Filed 1975·Granted May 31, 1977·13 cites·6 claims
- 2443US4908689AOrganic solder barrierIBM·Filed 1988·Granted Mar 13, 1990·10 cites·6 claims
- 2540US5807766AProcess for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the processFiled 1995·Granted Sep 15, 1998·7 cites·19 claims
- 2640US4965700AThin film package for mixed bonding of chipsIBM·Filed 1989·Granted Oct 23, 1990·9 cites·5 claims
- 2737US5427627AMethod for treating substratesIBM·Filed 1994·Granted Jun 27, 1995·5 cites·8 claims
- 2833US4707377ACopper platingIBM·Filed 1986·Granted Nov 17, 1987·5 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →