Inventor · disambiguated record
Dolores Babaran Milo
Also filed as: MILO DOLORES · MILO DOLORES B · Milo Dolores Babaran
20 granted patents·8 pending applications·28 citations·filing 2016–2025
91Inventor score
Files withTEXAS INSTRUMENTS INC28
Top patents by PatentIndex Score
28 records- 0186US9761536B1Angle referenced lead frame designTEXAS INSTRUMENTS INC·Filed 2016·Granted Sep 12, 2017·7 cites·25 claims
- 0285US10991621B2Semiconductor die singulationTEXAS INSTRUMENTS INC·Filed 2019·Granted Apr 27, 2021·5 cites·12 claims
- 0381US10811292B2Transport packaging and method for expanded wafersTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 20, 2020·3 cites·26 claims
- 0479US11742318B2Split tie bar for clip stabilityTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 29, 2023·1 cites·19 claims
- 0578US11211320B2Package with shifted lead neckTEXAS INSTRUMENTS INC·Filed 2019·Granted Dec 28, 2021·6 cites·15 claims
- 0675US2025364381A1Interconnect for ic packageTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0772US2025022776A1Lead frame for a dieTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0867US10573583B2Semiconductor device package with grooved substrateTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 25, 2020·1 cites·17 claims
- 0966US11749621B2Leadframe with ground pad cantileverTEXAS INSTRUMENTS INC·Filed 2022·Granted Sep 5, 2023·0 cites·17 claims
- 1065US12417965B2Interconnect for IC packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Sep 16, 2025·0 cites·23 claims
- 1165US9824959B2Structure and method for stabilizing leads in wire-bonded semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2016·Granted Nov 21, 2017·2 cites·15 claims
- 1263US9748686B1BGA spring probe pin designTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 29, 2017·2 cites·19 claims
- 1361US10964629B2Siderail with mold compound reliefTEXAS INSTRUMENTS INC·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
- 1460US11049800B2Semiconductor device package with grooved substrateTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 29, 2021·0 cites·19 claims
- 1560US2022157700A1Two sided bondable lead frameTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1659US11881434B2Semiconductor die singulationTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 23, 2024·0 cites·20 claims
- 1756US10872785B2QFN pin routing thru lead frame etchingTEXAS INSTRUMENTS INC·Filed 2019·Granted Dec 22, 2020·0 cites·17 claims
- 1854US11538768B2Leadframe with ground pad cantileverTEXAS INSTRUMENTS INC·Filed 2019·Granted Dec 27, 2022·0 cites·20 claims
- 1952US12341126B2Bump to package substrate solder jointTEXAS INSTRUMENTS INC·Filed 2022·Granted Jun 24, 2025·0 cites·21 claims
- 2052US12136587B2Lead frame for a dieTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 5, 2024·0 cites·38 claims
- 2152US10361098B2QFN pin routing thru lead frame etchingTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 23, 2019·0 cites·14 claims
- 2248US2023197575A1Die attach adhesive-ready lead frame designTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2347US2019355651A1Two sided bondable lead frameTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 2447US2023054963A1Integrated circuit having micro-etched channelsTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 2545US2022359352A1Electronic package with concave lead end facesTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 2643US10439313B2Integrated circuit (IC) chip socketTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 8, 2019·0 cites·22 claims
- 2737US11239130B2Selective molding for integrated circuitTEXAS INSTRUMENTS INC·Filed 2019·Granted Feb 1, 2022·0 cites·23 claims
- 2832US2018076072A1Air blow for semiconductor wafers in a vacuum semiconductor wafer laminator systemTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →