Inventor · disambiguated record
Donghyeon Na
Also filed as: NA DONGHYEON
7 granted patents·23 pending applications·10 citations·filing 2019–2025
76Inventor score
Files withSAMSUNG ELECTRONICS CO LTD30
Top patents by PatentIndex Score
30 records- 0193US11545341B2Plasma etching method and semiconductor device fabrication method including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 3, 2023·4 cites·20 claims
- 0283US11367597B2Electrostatic chuck and plasma processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 21, 2022·4 cites·16 claims
- 0379US11282679B2Plasma control apparatus and plasma processing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·2 cites·20 claims
- 0469US12020903B2Plasma etching method and semiconductor device fabrication method including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·10 claims
- 0566US12476089B2Plasma processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·19 claims
- 0666US2025104969A1Substrate processing apparatus and a substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0766US2025146917A1Method of measuring parameters of plasma, apparatus for measuring parameters of plasma, plasma processing system, and method of processing waferSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0863US2025299934A1Magnetic field generation device for plasma distribution control and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0963US2025349516A1Plasma control apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1062US12222362B2Method of measuring parameters of plasma, apparatus for measuring parameters of plasma, plasma processing system, and method of processing waferSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·17 claims
- 1161US2025266242A1Plasma etching devices and methods for fabricating semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1261US2025183004A1Plasma processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1359US2025183005A1Substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1459US2025174433A1Method of processing a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1559US2025253128A1Substrate processing apparatus and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1659US2025337619A1Frequency and power modulation radio frequency (rf) generatorSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1758US2025226259A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1858US2025218727A1Plasma generation circuit and substrate processing device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1958US2024420930A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2058US2025273443A1Substrate processing apparatus including edge bias supply portionSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2157US2025259827A1Plasma processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2257US2025069861A1Magnetic element assembly and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2356US2025316458A1Apparatus for processing a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2455US2025329513A1Inductively-coupled plasma antennas for semiconductor wafer processing systemsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2555US2025273442A1Plasma processing deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2655US2025357093A1Substrate processing device including variable impedance elementSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2755US2025226187A1Substrate processing apparatus for etching a substrate by using plasmaSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2854US2025246403A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2948US2024128054A1Plasma control apparatus and method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3044US12014905B2Apparatus and method fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →