Inventor · disambiguated record
Dongjoon Oh
Also filed as: OH DONGJOON
14 granted patents·14 pending applications·5 citations·filing 2019–2025
85Inventor score
Files withSAMSUNG ELECTRONICS CO LTD28
Top patents by PatentIndex Score
28 records- 0193US11996358B2Semiconductor packages having first and second redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 28, 2024·2 cites·18 claims
- 0283US2025336798A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0382US2025343146A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0481US12368093B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 0581US11798872B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·1 cites·20 claims
- 0676US12381151B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 0773US11139251B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 5, 2021·2 cites·20 claims
- 0871US2024290702A1Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0970US12347760B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·19 claims
- 1067US11664312B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·19 claims
- 1163US12451474B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·19 claims
- 1263US11923309B2Semiconductor package including fine redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 1362US12009288B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·19 claims
- 1459US11854893B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1559US2025125290A1Device for semiconductor package comprising connecting strucure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1659US2024234103A1Ring assembly and semiconductor wafer etching deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1758US11652066B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 16, 2023·0 cites·12 claims
- 1858US2025029941A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1957US12224256B2Wafer structure and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 2056US2024237349A1Three-dimensional semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2155US2024178202A1Semiconductor devices including bonded semiconductor layers and manufacturing methods of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2255US2024128239A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2355US2024162104A1Semiconductor device, semiconductor package, and semiconductor chip manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2455US2023420397A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2554US2024105680A1Semiconductor chip stack structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2654US2024145366A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2753US12456627B2Dry etching apparatus and wafer etching system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 2849US2023089399A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →