Inventor · disambiguated record
Dong Sub Oh
Also filed as: OH DONG SUB
9 granted patents·9 pending applications·19 citations·filing 2019–2024
78Inventor score
Files withSEMES CO LTD18
Top patents by PatentIndex Score
18 records- 0187US11148150B2Liquid dispensing nozzle and substrate treating apparatusSEMES CO LTD·Filed 2019·Granted Oct 19, 2021·17 cites·12 claims
- 0282US12308219B2Substrate treating method and substrate treating apparatusSEMES CO LTD·Filed 2022·Granted May 20, 2025·1 cites·6 claims
- 0377US12142492B2Method for treating substrate and apparatus for treating substrateSEMES CO LTD·Filed 2020·Granted Nov 12, 2024·1 cites·8 claims
- 0470US2024412951A1Apparatus for treating substrate and method for treating substrateSEMES CO LTD·Filed 2024·Application pending·0 cites
- 0558US2022076925A1Apparatus and method for processing substrate using plasmaSEMES CO LTD·Filed 2021·Application pending·0 cites
- 0658US2025273474A1Method and system for processing substrateSEMES CO LTD·Filed 2024·Application pending·0 cites
- 0756US12237151B2Apparatus and method for processing substrate using plasmaSEMES CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·13 claims
- 0856US2021287877A1Apparatus for treating substrate and method for treating substrateSEMES CO LTD·Filed 2021·Application pending·0 cites
- 0956US2024096603A1Apparatus for treating substrateSEMES CO LTD·Filed 2023·Application pending·0 cites
- 1055US12448680B2Method of forming pattern structure including silicon nitrideSEMES CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 1152US12146710B2Substrate treating apparatus and substrate treating system comprising the sameSEMES CO LTD·Filed 2021·Granted Nov 19, 2024·0 cites·19 claims
- 1251US12463015B2Substrate processing apparatus and method using the plasmaSEMES CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·18 claims
- 1351US2023215699A1Method of treating substrate and apparatus for treating substrateSEMES CO LTD·Filed 2022·Application pending·0 cites
- 1450US2023207248A1Substrate treating apparatus and substrate treating methodSEMES CO LTD·Filed 2022·Application pending·0 cites
- 1549US12451358B2Method for fabricating semiconductor device and apparatus for processing substrate using plasmaSEMES CO LTD·Filed 2021·Granted Oct 21, 2025·0 cites·5 claims
- 1649US2023144896A1Substrate treating apparatus and semiconductor manufacturing equipment including the sameSEMES CO LTD·Filed 2022·Application pending·0 cites
- 1748US2023317419A1Apparatus and method for processing substrate using plasmaSEMES CO LTD·Filed 2022·Application pending·0 cites
- 1844US12327735B2Apparatus and method for processing substrateSEMES CO LTD·Filed 2020·Granted Jun 10, 2025·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →