Inventor · disambiguated record
Dong Woon Park
Also filed as: PARK DONG W · PARK DONG WOON
23 granted patents·6 pending applications·68 citations·filing 2005–2024
93Inventor score
Top patents by PatentIndex Score
29 records- 0192US8871104B2Method of forming pattern, reticle, and computer readable medium for storing program for forming patternPARK DONG-WOON·Filed 2011·Granted Oct 28, 2014·23 cites·25 claims
- 0286US7460210B2Auto focus system, auto focus method, and exposure apparatus using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 2, 2008·11 cites·20 claims
- 0382US9631908B2ArrowWIN&WIN CO LTD·Filed 2015·Granted Apr 25, 2017·10 cites·12 claims
- 0479US9711395B2Overlay marks, methods of forming the same, and methods of fabricating semiconductor devices using the sameKIM JONG-SU·Filed 2015·Granted Jul 18, 2017·2 cites·20 claims
- 0579US7877723B2Method of arranging mask patterns and apparatus using the methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 25, 2011·6 cites·30 claims
- 0675US10643888B2Overlay marks, methods of forming the same, and methods of fabricating semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 5, 2020·1 cites·20 claims
- 0772US12198893B2Plasma process monitoring apparatus using terahertz waves and monitoring method thereofIUCF HYU·Filed 2024·Granted Jan 14, 2025·0 cites·14 claims
- 0870US12055378B2Thickness measuring deviceACTRO CO LTD·Filed 2020·Granted Aug 6, 2024·1 cites·19 claims
- 0968US7954073B2Methods of arranging mask patterns responsive to assist feature contribution to image intensity and associated apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 31, 2011·5 cites·13 claims
- 1066US12476119B2Substrate processing apparatus and substrate processing methodSEMES CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·15 claims
- 1164US8341561B2Methods of arranging mask patterns and associated apparatusPARK DONG-WOON·Filed 2010·Granted Dec 25, 2012·1 cites·18 claims
- 1264US7937676B2Method of arranging mask patterns and apparatus using the methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 3, 2011·2 cites·22 claims
- 1364US7433048B2Interferometer systems for measuring displacement and exposure systems using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 7, 2008·5 cites·46 claims
- 1463US10553438B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 4, 2020·1 cites·19 claims
- 1559US2024287190A1Bispecific molecule specifically binding to b7-h3 and tgfb and uses thereofTHERANOTICS CO LTD·Filed 2022·Application pending·0 cites
- 1657US2025102292A1Device and method for measuring thicknessACTRO CO LTD·Filed 2023·Application pending·0 cites
- 1757US2024158505A1B7-h3 antibody or antigen-binding fragment thereof, and use thereofTHERANOTICS CO LTD·Filed 2022·Application pending·0 cites
- 1856US11829070B2Apparatus for treating a substrateSEMES CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·10 claims
- 1956US2020222297A1Use of silicone fluids as insecticidesPARK JOHN Y·Filed 2020·Application pending·0 cites
- 2054US11486822B2Specimen inspection device and specimen inspection methodUNIV HANYANG IND UNIV COOP FOUND·Filed 2019·Granted Nov 1, 2022·0 cites·15 claims
- 2151US12428730B2Apparatus for treating substrateSEMES CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·18 claims
- 2251US10588842B2Use of silicone fluids as insecticidesPARK AND PARK·Filed 2015·Granted Mar 17, 2020·0 cites·17 claims
- 2350US11781981B2Specimen inspection apparatus and specimen inspection methodACTRO CO LTD·Filed 2019·Granted Oct 10, 2023·0 cites·13 claims
- 2449US11346659B2Device for measuring thickness of specimen and method for measuring thickness of specimenUNIV HANYANG IND UNIV COOP FOUND·Filed 2021·Granted May 31, 2022·0 cites·16 claims
- 2547US12331399B2Apparatus for smoothly exhausting the atmosphere in a processing space when rotating a substrate with liquidSEMES CO LTD·Filed 2021·Granted Jun 17, 2025·0 cites·16 claims
- 2644US11150080B2Thickness measurement apparatus, thickness measurement method, and thickness measurement programIUCF HYU·Filed 2018·Granted Oct 19, 2021·0 cites·17 claims
- 2742US8691693B2Methods of manufacturing semiconductor deviceKIM SANG-JIN·Filed 2011·Granted Apr 8, 2014·0 cites·15 claims
- 2842US2022268568A1Thickness measurement deviceIUCF HYU·Filed 2020·Application pending·0 cites
- 2940US2007002293A1Method measuring distortion using exposure equipmentPARK DONG-WOON·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →