Inventor · disambiguated record
Douglas P. Riemer
Also filed as: RIEMER DOUGLAS P
27 granted patents·8 pending applications·41 citations·filing 2014–2023
93Inventor score
Top patents by PatentIndex Score
35 records- 0196US10640879B2High aspect ratio electroplated structures and anisotropic electroplating processesHUTCHINSON TECHNOLOGY·Filed 2017·Granted May 5, 2020·5 cites·7 claims
- 0295US11199182B2Sensor shift structures in optical image stabilization suspensionsHUTCHINSON TECHNOLOGY·Filed 2017·Granted Dec 14, 2021·14 cites·32 claims
- 0391US12044219B2Sensor shift structures in optical image stabilization suspensionsHUTCHINSON TECHNOLOGY·Filed 2021·Granted Jul 23, 2024·7 cites·20 claims
- 0489US11867575B2Miniature pressure/force sensor with integrated leadsHUTCHINSON TECHNOLOGY·Filed 2022·Granted Jan 9, 2024·1 cites·13 claims
- 0586US12147059B2Sensor shift structures in optical image stabilization suspensionsHUTCHINSON TECHNOLOGY·Filed 2020·Granted Nov 19, 2024·2 cites·18 claims
- 0686US11322806B2Sensored battery electrodeHUTCHINSON TECHNOLOGY·Filed 2020·Granted May 3, 2022·1 cites·18 claims
- 0785US11387033B2High-aspect ratio electroplated structures and anisotropic electroplating processesHUTCHINSON TECHNOLOGY·Filed 2019·Granted Jul 12, 2022·2 cites·20 claims
- 0883US12216013B2Miniature pressure/force sensor with integrated leadsHUTCHINSON TECHNOLOGY·Filed 2023·Granted Feb 4, 2025·0 cites·6 claims
- 0983US10625083B2Metallized components and surgical instrumentsHUTCHINSON TECHNOLOGY·Filed 2017·Granted Apr 21, 2020·1 cites·23 claims
- 1081US11243127B2Miniature pressure/force sensor with integrated leadsHUTCHINSON TECHNOLOGY·Filed 2017·Granted Feb 8, 2022·2 cites·3 claims
- 1181US10925663B2Metallized components and surgical instrumentsHUTCHINSON TECHNOLOGY·Filed 2018·Granted Feb 23, 2021·1 cites·12 claims
- 1281US10570525B2Gold electroplating solution and methodHUTCHINSON TECHNOLOGY·Filed 2016·Granted Feb 25, 2020·1 cites·10 claims
- 1379US2024102174A1Etch Chemistry For Metallic MaterialsHUTCHINSON TECHNOLOGY·Filed 2023·Application pending·0 cites
- 1474US2022351893A1High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating ProcessesHUTCHINSON TECHNOLOGY·Filed 2022·Application pending·0 cites
- 1573US11873564B2Etch chemistry for metallic materialsHUTCHINSON TECHNOLOGY·Filed 2019·Granted Jan 16, 2024·0 cites·7 claims
- 1673US11782286B2Shape memory alloy wire attachment structures for a suspension assemblyHUTCHINSON TECHNOLOGY·Filed 2016·Granted Oct 10, 2023·1 cites·77 claims
- 1772US9935251B1LED chip packaging with high performance thermal dissipationHUTCHINSON TECHNOLOGY·Filed 2014·Granted Apr 3, 2018·3 cites·15 claims
- 1870US12173423B2Gold electroplating solution and methodHUTCHINSON TECHNOLOGY·Filed 2020·Granted Dec 24, 2024·0 cites·5 claims
- 1968US12378687B2High aspect ratio electroplated structures and anisotropic electroplating processesHUTCHINSON TECHNOLOGY·Filed 2020·Granted Aug 5, 2025·0 cites·18 claims
- 2065US11791521B2Electrode tabs and methods of formingHUTCHINSON TECHNOLOGY·Filed 2020·Granted Oct 17, 2023·0 cites·23 claims
- 2165US2020215334A1Metallized components and surgical instrumentsHUTCHINSON TECHNOLOGY·Filed 2020·Application pending·0 cites
- 2260US12195870B2Microetch neutralizer chemistry for Ni—Au plating defect eliminationHUTCHINSON TECHNOLOGY·Filed 2021·Granted Jan 14, 2025·0 cites·12 claims
- 2359US11932948B2Electroless nickel etch chemistry, method of etching and pretreatmentHUTCHINSON TECHNOLOGY·Filed 2021·Granted Mar 19, 2024·0 cites·9 claims
- 2457US11109493B2Electroless plating activationHUTCHINSON TECHNOLOGY·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
- 2556US12159983B2Sensored battery pouchHUTCHINSON TECHNOLOGY·Filed 2019·Granted Dec 3, 2024·0 cites·18 claims
- 2656US11898264B2Treatment methods and solutions for improving adhesion of gold electroplating on metal surfacesHUTCHINSON TECHNOLOGY·Filed 2021·Granted Feb 13, 2024·0 cites·12 claims
- 2755US2020045831A1Method of forming material for a circuit using nickel and phosphorousHUTCHINSON TECHNOLOGY·Filed 2019·Application pending·0 cites
- 2855US2024170208A1High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating ProcessesHUTCHINSON TECHNOLOGY·Filed 2022·Application pending·0 cites
- 2952US2020291525A1Process and apparatus for selective passivation of electroless nickel activation or nucleation sitesHUTCHINSON TECHNOLOGY·Filed 2020·Application pending·0 cites
- 3051US12460291B2Surface treatment producing high conductivity vias with simultaneous polymer adhesionHUTCHINSON TECHNOLOGY·Filed 2021·Granted Nov 4, 2025·0 cites·12 claims
- 3151US11674235B2Plating method to reduce or eliminate voids in solder applied without fluxHUTCHINSON TECHNOLOGY·Filed 2019·Granted Jun 13, 2023·0 cites·5 claims
- 3248US10910004B2Disk drive suspension baseplate having enhanced torque retention and method of manufactureMMI TECH PTE LTD·Filed 2017·Granted Feb 2, 2021·0 cites·15 claims
- 3346US2021247218A1Systems And Methods To Increase Sensor RobustnessHUTCHINSON TECHNOLOGY·Filed 2020·Application pending·0 cites
- 3443US2017113297A1Metallizing polymers, ceramics and composites for attachment structuresHUTCHINSON TECHNOLOGY·Filed 2016·Application pending·0 cites
- 3540US11713514B2Systems for electroplating and methods of use thereofHUTCHINSON TECHNOLOGY·Filed 2020·Granted Aug 1, 2023·0 cites·31 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →