Inventor · disambiguated record
Donald W. Schulte
Also filed as: SCHULTE DONALD W
46 granted patents·3 pending applications·516 citations·filing 1999–2024
98Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO33HEWLETT PACKARD CO7CHEN CHIEN-HUA1GOVYADINOV ALEXANDER1HEWLETT PACKARD COMPNAY1
Top patents by PatentIndex Score
49 records- 0194US8336981B2Determining a healthy fluid ejection nozzleCHEN CHIEN-HUA·Filed 2009·Granted Dec 25, 2012·24 cites·11 claims
- 0292US6447104B1Firing chamber geometry for inkjet printheadHEWLETT PACKARD CO·Filed 2001·Granted Sep 10, 2002·53 cites·22 claims
- 0391US6276775B1Variable drop mass inkjet drop generatorHEWLETT PACKARD CO·Filed 1999·Granted Aug 21, 2001·65 cites·14 claims
- 0490US6627467B2Fluid ejection device fabricationHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Sep 30, 2003·36 cites·23 claims
- 0587US7490924B2Drop generator for ultra-small dropletsHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Feb 17, 2009·38 cites·16 claims
- 0686US6448100B1Method for fabricating self-aligned field emitter tipsHEWLETT PACKARD COMPNAY·Filed 2001·Granted Sep 10, 2002·26 cites·18 claims
- 0785US6698868B2Thermal drop generator for ultra-small dropletsHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Mar 2, 2004·27 cites·9 claims
- 0884US6513913B2Heating element of a printhead having conductive layer between resistive layersHEWLETT PACKARD CO·Filed 2001·Granted Feb 4, 2003·21 cites·17 claims
- 0981US12358243B2Printing conductive elementsPERIDOT PRINT LLC·Filed 2024·Granted Jul 15, 2025·0 cites·6 claims
- 1080US7282448B2Substrate and method of forming substrate for fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Oct 16, 2007·3 cites·36 claims
- 1178US6960978B2Fuse structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Nov 1, 2005·23 cites·22 claims
- 1278US6512284B2Thinfilm fuse/antifuse device and use of same in printheadHEWLETT PACKARD CO·Filed 1999·Granted Jan 28, 2003·68 cites·16 claims
- 1376US11667128B2Fluidic die with monitoring circuit fault protection structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jun 6, 2023·2 cites·15 claims
- 1476US6981759B2Substrate and method forming substrate for fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jan 3, 2006·9 cites·23 claims
- 1575US6599761B2Monitoring and test structures for silicon etchingHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Jul 29, 2003·18 cites·7 claims
- 1674US10933634B2Conductive wire disposed in a layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Mar 2, 2021·1 cites·18 claims
- 1774US6871942B2Bonding structure and method of makingFiled 2002·Granted Mar 29, 2005·12 cites·43 claims
- 1871US6402283B2Variable drop mass inkjet drop generatorHEWLETT PACKARD CO·Filed 2001·Granted Jun 11, 2002·11 cites·23 claims
- 1970US10675867B2Thermal inkjet resistor circuitHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jun 9, 2020·0 cites·13 claims
- 2070US7125731B2Drop generator for ultra-small dropletsHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Oct 24, 2006·10 cites·18 claims
- 2170US6361150B1Electrostatic discharge protection of electrically-inactive components in a thermal ink jet printing systemHEWLETT PACKARD CO·Filed 1999·Granted Mar 26, 2002·28 cites·36 claims
- 2270US6314216B1Resistor array with position dependent heat dissipationHEWLETT PACKARD CO·Filed 2000·Granted Nov 6, 2001·10 cites·12 claims
- 2369US9707586B2Printhead with recessed slot endsRIVAS RIO·Filed 2012·Granted Jul 18, 2017·1 cites·20 claims
- 2469US8770707B2Drop detector assembly and methodGOVYADINOV ALEXANDER·Filed 2010·Granted Jul 8, 2014·1 cites·14 claims
- 2569US7758169B2Printheads and printhead cartridges using a printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jul 20, 2010·2 cites·28 claims
- 2669US7550365B2Bonding structure and method of makingHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jun 23, 2009·2 cites·4 claims
- 2766US7798611B2Circuit routing for printhead having increased corrosion resistanceHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Sep 21, 2010·2 cites·3 claims
- 2862US10369788B2Printhead with recessed slot endsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Aug 6, 2019·0 cites·20 claims
- 2962US6549690B2Resistor array with position dependent heat dissipationHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Apr 15, 2003·6 cites·7 claims
- 3060US10272671B2Isolating failed resistorsHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Apr 30, 2019·0 cites·13 claims
- 3159US2021170678A1Printing conductive elementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 3257US11225070B2Fluidic dies with beveled edges underneath electrical leadsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jan 18, 2022·0 cites·20 claims
- 3356US6567251B1Electrostatic discharge protection of electrically-inactive componentsHEWLETT PACKARD DEVELOPMENT CO·Filed 1999·Granted May 20, 2003·15 cites·24 claims
- 3455US10752015B2Dissipating heat of heating elementsHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2016·Granted Aug 25, 2020·0 cites·20 claims
- 3554US11173708B2Fluidic die with monitoring circuit fault protectionHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Nov 16, 2021·0 cites·15 claims
- 3651US11214060B2Gaps between electrically conductive ground structuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jan 4, 2022·0 cites·17 claims
- 3750US7669314B2Method of fabricating a fluid ejection device having a data storage structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Mar 2, 2010·0 cites·9 claims
- 3847US7209027B2Fuse structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Apr 24, 2007·0 cites·9 claims
- 3946US10814629B2Termination ring with gapped metallic layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Oct 27, 2020·0 cites·15 claims
- 4046US7924597B2Data storage in circuit elements with changed resistanceHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Apr 12, 2011·0 cites·18 claims
- 4146US7170387B2Fuse structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jan 30, 2007·0 cites·4 claims
- 4243US10421275B2Fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Sep 24, 2019·0 cites·17 claims
- 4341US7249825B2Fluid ejection device with data storage structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jul 31, 2007·1 cites·13 claims
- 4440US7083265B2Circuit routing for printhead having increased corrosion resistanceHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Aug 1, 2006·1 cites·13 claims
- 4539US6933237B2Substrate etch method and deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Aug 23, 2005·0 cites·43 claims
- 4637US6711806B2Method of manufacturing a thermal fluid jetting apparatusHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Mar 30, 2004·0 cites·4 claims
- 4736US7679426B2Transistor antifuse deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Mar 16, 2010·0 cites·51 claims
- 4836US2003202264A1Micro-mirror deviceFiled 2002·Application pending·0 cites
- 4936US2002185947A1Micro ion pump for a low-pressure microdevice microenclosureFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →