Inventor · disambiguated record
Doosoub Shin
Also filed as: SHIN DOOSOUB
0 granted patents·5 pending applications·0 citations·filing 2023–2024
Files withQUALCOMM INC5
Top patents by PatentIndex Score
5 records- 0154US2025203261A1Microphone three-dimensional (3d) stacked packageQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0252US2025379557A1Acoustic filter device including an acoustic filter and one or more integrated passive devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0352US2024297165A1Double-sided redistribution layer (rdl) substrate with double-sided pillars for device integrationQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0450US2024321724A1Metal-insulator-metal (mim) capacitor interconnect for high-quality (q) inductor-capacitor (lc) filterQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0549US2025164713A1Antenna device including fiber attached glassQUALCOMM INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →