Inventor · disambiguated record
Dong-Kil Shin
Also filed as: SHIN DONG-KIL
11 granted patents·4 pending applications·49 citations·filing 2001–2018
87Inventor score
Top patents by PatentIndex Score
15 records- 0181US8120176B2Semiconductor device having a conductive bumpSHIN DONG-KIL·Filed 2010·Granted Feb 21, 2012·8 cites·19 claims
- 0274US6756668B2Semiconductor package having thermal interface material (TIM)SAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 29, 2004·19 cites·15 claims
- 0369US6638638B2Hollow solder structure having improved reliability and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Oct 28, 2003·11 cites·13 claims
- 0465US8922012B2Integrated circuit chip and flip chip package having the integrated circuit chipPARK JIN-WOO·Filed 2010·Granted Dec 30, 2014·2 cites·11 claims
- 0560US8175652B2Terminal and method of controlling the sameSHIN DONG KIL·Filed 2008·Granted May 8, 2012·1 cites·23 claims
- 0653US6963033B2Ball grid array attaching means having improved reliability and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 8, 2005·4 cites·36 claims
- 0752US7081375B2Semiconductor package having thermal interface material (TIM)SAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 25, 2006·4 cites·8 claims
- 0849US10393646B2Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the sameSK HYNIX INC·Filed 2018·Granted Aug 27, 2019·0 cites·9 claims
- 0946US9945772B2Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the sameSK HYNIX INC·Filed 2016·Granted Apr 17, 2018·0 cites·18 claims
- 1045US2009032916A1Semiconductor package apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1142US2008122056A1Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1238US2007029674A1Board-on-chip package and stack package using the sameSHIN DONG-KIL·Filed 2006·Application pending·0 cites
- 1337US10552022B2Display control method, apparatus, and non-transitory computer-readable recording mediumNAVER CORP·Filed 2016·Granted Feb 4, 2020·0 cites·12 claims
- 1437US2004163843A1Multi-chip package with soft element and method of manufacturing the sameFiled 2004·Application pending·0 cites
- 1533US8427841B2Electronic deviceSHIN DONG-KIL·Filed 2010·Granted Apr 23, 2013·0 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Dong-Kil Shin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →