Inventor · disambiguated record
Donghyun Son
Also filed as: SON DONGHYUN
4 granted patents·10 pending applications·12 citations·filing 2013–2025
63Inventor score
Top patents by PatentIndex Score
14 records- 0173US9339345B2Cutting apparatus for joint cutting system using robotCUREXO CO LTD·Filed 2013·Granted May 17, 2016·12 cites·10 claims
- 0262US11563126B2Method of manufacturing thin film transistor and display device including polishing capping layer coplanar with active layerSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Jan 24, 2023·0 cites·12 claims
- 0358US2025097328A1Electronic deviceSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 0458US2025287821A1Electronic deviceSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 0557US2025318392A1Display panel and electronic apparatus including the sameSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 0657US2025008786A1Display panel and electronic deviceSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 0754US11063155B2Display device including thin film transistor with active layer portions having different thicknessesSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·10 claims
- 0854US2024074232A1Display deviceSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 0953US11751447B2Display apparatusSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 1052US2024023401A1Electronic deviceSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 1151US2023055469A1Display deviceSAMSUNG DISPLAY CO LTD·Filed 2022·Application pending·0 cites
- 1250US2024074251A1Display apparatus and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 1350US2024023387A1Electronic deviceSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 1448US2025324872A1Display apparatus and an electronic device including the sameSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →