Inventor · disambiguated record
Doowon Suh
Also filed as: SUH DOOWON
7 granted patents·3 pending applications·265 citations·filing 2001–2017
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0197US6853076B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2001·Granted Feb 8, 2005·203 cites·7 claims
- 0288US7196001B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2004·Granted Mar 27, 2007·34 cites·7 claims
- 0372US8952550B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameDATTA MADHAV·Filed 2010·Granted Feb 10, 2015·2 cites·3 claims
- 0470US10037956B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2015·Granted Jul 31, 2018·1 cites·7 claims
- 0569US7250678B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2004·Granted Jul 31, 2007·10 cites·1 claims
- 0663US6740427B2Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making sameINTEL CORP·Filed 2001·Granted May 25, 2004·13 cites·25 claims
- 0762US9437785B2Light emitting diodes including integrated backside reflector and die attachBERGMANN MICHAEL JOHN·Filed 2009·Granted Sep 6, 2016·2 cites·23 claims
- 0857US2017141062A1Copper-containing c4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2017·Application pending·0 cites
- 0948US2006148233A1Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameDATTA MADHAV·Filed 2006·Application pending·0 cites
- 1035US2003060041A1Dual-stack, ball-limiting metallurgy and method of making sameINTEL CORP·Filed 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Doowon Suh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →