Inventor · disambiguated record
Dominik Truessel
Also filed as: TRUESSEL DOMINIK
12 granted patents·5 pending applications·1 citations·filing 2010–2024
79Inventor score
Files withHITACHI ENERGY LTD8HITACHI ENERGY SWITZERLAND AG4ABB POWER GRIDS SWITZERLAND AG2ABB SCHWEIZ AG1ABB TECHNOLOGY AG1
Top patents by PatentIndex Score
17 records- 0169US2024355704A1Power semiconductor moduleHITACHI ENERGY LTD·Filed 2024·Application pending·0 cites
- 0258US8013435B2Semiconductor moduleABB TECHNOLOGY AG·Filed 2010·Granted Sep 6, 2011·1 cites·20 claims
- 0356US12062591B2Power semiconductor module with baseplate and heat dissipating elementHITACHI ENERGY LTD·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 0455US12125767B2Clamping element and method for producing a power semiconductor deviceHITACHI ENERGY LTD·Filed 2022·Granted Oct 22, 2024·0 cites·14 claims
- 0554US12444692B2Power module comprising a semiconductor module component and an alignment part, and method for forming the power moduleHITACHI ENERGY LTD·Filed 2023·Granted Oct 14, 2025·0 cites·14 claims
- 0651US2023411875A1Power module comprising positioning structures, alignment tool and method for positioning and aligning the power moduleHITACHI ENERGY SWITZERLAND AG·Filed 2023·Application pending·0 cites
- 0749US12494409B2Power semiconductor componentHITACHI ENERGY LTD·Filed 2021·Granted Dec 9, 2025·0 cites·15 claims
- 0848US12278163B2Power semiconductor module with injection-molded or laminated cooler assemblyHITACHI ENERGY LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 0948US11502434B2Power semiconductor moduleHITACHI ENERGY SWITZERLAND AG·Filed 2019·Granted Nov 15, 2022·0 cites·20 claims
- 1046US11031323B2Interconnecting member for power moduleABB POWER GRIDS SWITZERLAND AG·Filed 2019·Granted Jun 8, 2021·0 cites·20 claims
- 1146US2024120255A1Power semiconductor module, power semiconductor device and method for producing a power semiconductor deviceHITACHI ENERGY SWITZERLAND AG·Filed 2022·Application pending·0 cites
- 1245US12489039B2Pre-product, method and electronic deviceHITACHI ENERGY LTD·Filed 2021·Granted Dec 2, 2025·0 cites·11 claims
- 1345US10854524B2Power semiconductor moduleABB SCHWEIZ AG·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
- 1442US2024145332A1Power semiconductor device and manufacturing methodHITACHI ENERGY LTD·Filed 2022·Application pending·0 cites
- 1542US2023317684A1Power Semiconductor Module and Manufacturing MethodHITACHI ENERGY SWITZERLAND AG·Filed 2021·Application pending·0 cites
- 1640US11127671B2Power semiconductor moduleABB POWER GRIDS SWITZERLAND AG·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 1727US8410368B2Electrical conductorHARTMANN SAMUEL·Filed 2010·Granted Apr 2, 2013·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →