Inventor · disambiguated record
Dongdong Wang
Also filed as: WANG DONGDONG
91 granted patents·28 pending applications·1,831 citations·filing 1999–2025
99Inventor score
Top patents by PatentIndex Score
119 records- 0199US7307852B2Printed circuit board and method for manufacturing printed circuit boardIBIDEN CO LTD·Filed 2005·Granted Dec 11, 2007·82 cites·21 claims
- 0299US6876554B1Printing wiring board and method of producing the same and capacitor to be contained in printed wiring boardIBIDEN CO LTD·Filed 2000·Granted Apr 5, 2005·160 cites·4 claims
- 0399US6828510B1Multilayer printed wiring board and method of manufacturing multilayer printed wiring boardIBIDEN CO LTD·Filed 2000·Granted Dec 7, 2004·176 cites·21 claims
- 0499US6724638B1Printed wiring board and method of producing the sameIBIDEN CO LTD·Filed 2000·Granted Apr 20, 2004·249 cites·10 claims
- 0598US7978478B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Jul 12, 2011·46 cites·8 claims
- 0698US7852634B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Dec 14, 2010·55 cites·15 claims
- 0798US7842887B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Nov 30, 2010·45 cites·36 claims
- 0898US6909054B2Multilayer printed wiring board and method for producing multilayer printed wiring boardIBIDEN CO LTD·Filed 2001·Granted Jun 21, 2005·131 cites·7 claims
- 0997US7342803B2Printed circuit board and method of manufacturing printed circuit boardIBIDEN CO LTD·Filed 2004·Granted Mar 11, 2008·92 cites·20 claims
- 1096US7855894B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Dec 21, 2010·26 cites·12 claims
- 1196US7504719B2Printed wiring board having a roughened surface formed on a metal layer, and method for producing the sameIBIDEN CO LTD·Filed 2005·Granted Mar 17, 2009·33 cites·16 claims
- 1295US10959892B2Management device and control device for autonomous patient transportation vehiclePANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 30, 2021·16 cites·18 claims
- 1395US8830691B2Printed circuit board and method of manufacturing printed circuit boardINAGAKI YASUSHI·Filed 2010·Granted Sep 9, 2014·12 cites·28 claims
- 1495US8453323B2Printed circuit board manufacturing methodSAKAMOTO HAJIME·Filed 2011·Granted Jun 4, 2013·12 cites·17 claims
- 1595US7995352B2Printed circuit boardIBIDEN CO LTD·Filed 2010·Granted Aug 9, 2011·11 cites·18 claims
- 1695US7864542B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Jan 4, 2011·21 cites·14 claims
- 1795US7435910B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2004·Granted Oct 14, 2008·63 cites·18 claims
- 1895US6586276B2Method for fabricating a microelectronic device using wafer-level adhesion layer depositionINTEL CORP·Filed 2001·Granted Jul 1, 2003·122 cites·31 claims
- 1994US8018045B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Sep 13, 2011·18 cites·23 claims
- 2094US7893360B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Feb 22, 2011·18 cites·34 claims
- 2193US8079142B2Printed circuit board manufacturing methodSAKAMOTO HAJIME·Filed 2008·Granted Dec 20, 2011·15 cites·13 claims
- 2293US7985930B2Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2004·Granted Jul 26, 2011·30 cites·28 claims
- 2393US7535095B1Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 1999·Granted May 19, 2009·59 cites·13 claims
- 2492US8331102B2Printed circuit boardINAGAKI YASUSHI·Filed 2008·Granted Dec 11, 2012·14 cites·19 claims
- 2592US8186045B2Multilayer printed circuit board and multilayer printed circuit board manufacturing methodSAKAMOTO HAJIME·Filed 2008·Granted May 29, 2012·14 cites·9 claims
- 2692US8116091B2Printed circuit boardINAGAKI YASUSHI·Filed 2010·Granted Feb 14, 2012·7 cites·22 claims
- 2792US7888606B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Feb 15, 2011·14 cites·18 claims
- 2892US7881069B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Feb 1, 2011·13 cites·14 claims
- 2991US8288665B2Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit boardASAI MOTOO·Filed 2010·Granted Oct 16, 2012·7 cites·26 claims
- 3091US8283573B2Multi-layer printed circuit board and method of manufacturing multilayer printed circuit boardASAI MOTOO·Filed 2010·Granted Oct 9, 2012·7 cites·16 claims
- 3191US8020291B2Method of manufacturing a printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Sep 20, 2011·13 cites·10 claims
- 3290US8780573B2Printed circuit boardINAGAKI YASUSHI·Filed 2012·Granted Jul 15, 2014·6 cites·20 claims
- 3390US8745863B2Method of manufacturing multi-layer printed circuit boardASAI MOTOO·Filed 2011·Granted Jun 10, 2014·6 cites·20 claims
- 3489US10462014B1Positioning network devicesGOOGLE LLC·Filed 2017·Granted Oct 29, 2019·6 cites·16 claims
- 3589US8006377B2Method for producing a printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Aug 30, 2011·9 cites·13 claims
- 3689US7864543B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Jan 4, 2011·9 cites·8 claims
- 3788US8822323B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardSAKAMOTO HAJIME·Filed 2010·Granted Sep 2, 2014·6 cites·22 claims
- 3888US8107253B2Printed circuit boardINAGAKI YASUSHI·Filed 2008·Granted Jan 31, 2012·9 cites·16 claims
- 3988US7855342B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2001·Granted Dec 21, 2010·29 cites·71 claims
- 4087US9245838B2Semiconductor elementIBIDEN CO LTD·Filed 2015·Granted Jan 26, 2016·3 cites·20 claims
- 4187US8067699B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardSAKAMOTO HAJIME·Filed 2008·Granted Nov 29, 2011·8 cites·15 claims
- 4287US8030577B2Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 2008·Granted Oct 4, 2011·9 cites·15 claims
- 4386US9929432B2Low temperature sulfur and sodium metal battery for grid-scale energy storage applicationUNIV CALIFORNIA·Filed 2013·Granted Mar 27, 2018·4 cites·11 claims
- 4486US8288664B2Multi-layer printed circuit board and method of manufacturing multilayer printed circuit boardASAI MOTOO·Filed 2008·Granted Oct 16, 2012·7 cites·17 claims
- 4584US10666521B1Positioning network devicesGOOGLE LLC·Filed 2019·Granted May 26, 2020·4 cites·20 claims
- 4684US8959756B2Method of manufacturing a printed circuit board having an embedded electronic componentSAKAMOTO HAJIME·Filed 2008·Granted Feb 24, 2015·6 cites·20 claims
- 4784US8524535B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardSAKAMOTO HAJIME·Filed 2008·Granted Sep 3, 2013·6 cites·16 claims
- 4884US7908745B2Method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Mar 22, 2011·6 cites·3 claims
- 4983US7916492B1Multilayered printed circuit boardIBIDEN CO LTD·Filed 2000·Granted Mar 29, 2011·25 cites·6 claims
- 5082US7999387B2Semiconductor element connected to printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Aug 16, 2011·5 cites·9 claims
Showing the top 50 of 119 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →