Inventor · disambiguated record
Donghoon Won
Also filed as: WON DONGHOON
7 granted patents·4 pending applications·5 citations·filing 2017–2025
74Inventor score
Top patents by PatentIndex Score
11 records- 0180US11469180B2Semiconductor device including an insulating material layer with concave-convex portionsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·1 cites·19 claims
- 0279US2025357216A1Semiconductor substrate and method of dicing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0378US11721669B2Semiconductor package including a first semiconductor stack and a second semiconductor stack of different widthsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·1 cites·17 claims
- 0476US10418335B2Substrate, method of sawing substrate, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 17, 2019·2 cites·15 claims
- 0572US10916509B2Substrate, method of sawing substrate, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·1 cites·19 claims
- 0667US11935832B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 0759US2025237956A1Hardmask composition, hardmask layer, and method of forming patternsSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 0859US2025279373A1Semiconductor device and a method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0958US2025174600A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1057US12406888B2Semiconductor substrate and method of dicing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 2, 2025·0 cites·16 claims
- 1143US11932715B2Hardmask composition and method of forming patternsSAMSUNG SDI CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →