Inventor · disambiguated record
Dongji Xie
Also filed as: XIE DONGJI
4 granted patents·2 pending applications·10 citations·filing 2010–2023
64Inventor score
Top patents by PatentIndex Score
6 records- 0176US9329227B2Method and apparatus for testing interconnection reliability of a ball grid array on a testing printed circuit boardNVIDIA CORP·Filed 2012·Granted May 3, 2016·8 cites·11 claims
- 0259US8534136B2Pin soldering for printed circuit board failure testingXIE DONGJI·Filed 2010·Granted Sep 17, 2013·2 cites·22 claims
- 0353US2025081349A1Secure electronic component assemblyNVIDIA CORP·Filed 2023·Application pending·0 cites
- 0452US2025079344A1Security chip for ensuring the physical integrity of an integrated circuitNVIDIA CORP·Filed 2023·Application pending·0 cites
- 0547US12249589B2Apparatus and method for BGA coplanarity and warpage controlNVIDIA CORP·Filed 2022·Granted Mar 11, 2025·0 cites·32 claims
- 0632US9283698B2System and method for preventing warpage of metal components during manufacturing processesDU SHOUZHONG ALEX·Filed 2011·Granted Mar 15, 2016·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Dongji Xie files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →