Inventor · disambiguated record
Do Jae Yoo
Also filed as: YOO DO JAE
32 granted patents·23 pending applications·146 citations·filing 2008–2025
96Inventor score
Top patents by PatentIndex Score
55 records- 0194US8017437B2Method for manufacturing a semiconductor packageSAMSUNG ELECTRO & MDASH MECHANICS CO LTD·Filed 2009·Granted Sep 13, 2011·45 cites·8 claims
- 0292US9748179B2Package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 29, 2017·8 cites·6 claims
- 0391US9496219B2Semiconductor package including an antenna formed in a groove within a sealing elementSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 15, 2016·8 cites·8 claims
- 0490US8736031B2Semiconductor packageLEE JUNG AUN·Filed 2011·Granted May 27, 2014·14 cites·8 claims
- 0589US7642656B2Semiconductor package and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jan 5, 2010·15 cites·7 claims
- 0687US12453012B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2023·Granted Oct 21, 2025·1 cites·24 claims
- 0786US9209114B2Power module package with a fastening unit including a non-conductive portionSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 8, 2015·7 cites·8 claims
- 0884US2025393132A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2025·Application pending·0 cites
- 0983US9076660B2Power module packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 7, 2015·6 cites·18 claims
- 1080US7875497B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 25, 2011·6 cites·4 claims
- 1180US7875983B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 25, 2011·6 cites·5 claims
- 1280US2024365475A1Reprint apparatus for circuit board and reprint method using the sameSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1379US12262477B2Reprint apparatus for circuit board and reprint method using the sameSAMSUNG ELECTRO MECH·Filed 2023·Granted Mar 25, 2025·0 cites·18 claims
- 1479US9202798B2Power module package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 1, 2015·5 cites·12 claims
- 1578US9633923B2Electronic device module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 25, 2017·4 cites·8 claims
- 1677US10163746B2Semiconductor package with improved signal stability and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 25, 2018·3 cites·20 claims
- 1777US9245858B2Semiconductor device package with integrated antenna for wireless applicationsHAN MYEONG WOO·Filed 2011·Granted Jan 26, 2016·4 cites·11 claims
- 1872US9030823B2Heat dissipation system for power moduleKIM KWANG SOO·Filed 2012·Granted May 12, 2015·3 cites·10 claims
- 1967US9585260B2Electronic component module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 28, 2017·2 cites·6 claims
- 2063US9343391B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted May 17, 2016·1 cites·3 claims
- 2162US10219380B2Electronic device module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Granted Feb 26, 2019·1 cites·17 claims
- 2260US9894790B2Electronic component module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 13, 2018·0 cites·20 claims
- 2359US10667419B2Manufacturing method of an electronic component moduleSAMSUNG ELECTRO MECH·Filed 2017·Granted May 26, 2020·0 cites·15 claims
- 2456US2017018513A1Semiconductor package including an antenna formed in a groove within a sealing elementSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 2555US2013217181A1Method of manufacturing semiconductor packageSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2652US2013009320A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 2752US2014220743A1Power module package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2850US9048199B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRO MECH·Filed 2012·Granted Jun 2, 2015·0 cites·3 claims
- 2950US2017301632A1Package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 3049US2020395396A1Image sensor packageSAMSUNG ELECTRO MECH·Filed 2019·Application pending·0 cites
- 3148US11387270B2Image sensor package including reflectorSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 12, 2022·0 cites·22 claims
- 3248US9105601B2Power module packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 11, 2015·0 cites·15 claims
- 3348US2014313676A1Electronic component packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3447US8779580B2Electronic component package and manufacturing method thereofKANG JOON-SEOK·Filed 2008·Granted Jul 15, 2014·0 cites·5 claims
- 3547USD708578STerminal pinSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 8, 2014·5 cites·1 claims
- 3646US9508565B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Nov 29, 2016·0 cites·12 claims
- 3746US2016126200A1Semiconductor device package with integrated antenna for wireless applicationsSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3845US2015054173A1Semiconductor package, method of manufacturing semiconductor package and stack type semiconductor packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3945US2015136451A1Electronic component moduleSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4044US2015131231A1Electronic component module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4144US2010295172A1Power semiconductor moduleGAO SHAN·Filed 2009·Application pending·0 cites
- 4244US2015091146A1Power semiconductor packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4344US2015115443A1Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4444US2015181708A1Semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4543US9123683B2Unit power module and power module package comprising the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 1, 2015·0 cites·14 claims
- 4643US2014167237A1Power module packageSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4742US2014110833A1Power module packageSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4840US10109595B2Double-sided package module and substrate stripSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 23, 2018·0 cites·19 claims
- 4939US10356911B2Electronic device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Jul 16, 2019·0 cites·18 claims
- 5039US2014029201A1Power package module and manufacturing method thereofYANG SI JOONG·Filed 2012·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Do Jae Yoo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →