Inventor · disambiguated record
Dudi Amir
Also filed as: AMIR DUDI · AMIR DUDI I
8 granted patents·6 pending applications·61 citations·filing 1999–2018
85Inventor score
Top patents by PatentIndex Score
14 records- 0175US6555761B2Printed circuit board with solder-filled viaINTEL CORP·Filed 2000·Granted Apr 29, 2003·20 cites·17 claims
- 0274US6787920B2Electronic circuit board manufacturing process and associated apparatusINTEL CORP·Filed 2002·Granted Sep 7, 2004·23 cites·12 claims
- 0358US7185799B2Method of creating solder bar connections on electronic packagesINTEL CORP·Filed 2004·Granted Mar 6, 2007·8 cites·12 claims
- 0452US7538440B2Method for improved high current component interconnectionsINTEL CORP·Filed 2003·Granted May 26, 2009·3 cites·4 claims
- 0552US2007125833A1Method for improved high current component interconnectionsAMIR DUDI I·Filed 2007·Application pending·0 cites
- 0651US6840169B2Methods for manufacturing printed circuit boards using a partial printing process and apparatusINTEL CORP·Filed 2003·Granted Jan 11, 2005·3 cites·20 claims
- 0749US2005225953A1Method for improved high current component interconnectionsAMIR DUDI I·Filed 2005·Application pending·0 cites
- 0847US2005235488A1Selective area solder placementINTEL CORP·Filed 2005·Application pending·0 cites
- 0944US6933449B2Selective area solder placementINTEL CORP·Filed 2002·Granted Aug 23, 2005·1 cites·8 claims
- 1041US6823783B2Blocking cap for use in a partial printing process and apparatusINTEL CORP·Filed 2003·Granted Nov 30, 2004·0 cites·30 claims
- 1141US2006203459A1Method of mounting a substrate to a motherboardMORGAN THOMAS O·Filed 2005·Application pending·0 cites
- 1240US2006109121A1RFID embedded in deviceDISHONGH TERRY J·Filed 2004·Application pending·0 cites
- 1336US2019221456A1Selective and multilevel solder paste pin transferINTEL CORP·Filed 2018·Application pending·0 cites
- 1432US6626099B1Partial printing process and apparatusINTEL CORP·Filed 1999·Granted Sep 30, 2003·3 cites·31 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →