Inventor · disambiguated record
Duk-Ho Hong
Also filed as: HONG DUK-HO
5 granted patents·3 pending applications·37 citations·filing 2002–2006
78Inventor score
Top patents by PatentIndex Score
8 records- 0179US7166019B2Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 23, 2007·14 cites·20 claims
- 0268US6976902B2Chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 20, 2005·12 cites·20 claims
- 0367US7435673B2Methods of forming integrated circuit devices having metal interconnect structures thereinSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 14, 2008·4 cites·16 claims
- 0460US7282451B2Methods of forming integrated circuit devices having metal interconnect layers thereinINFINEON TECHNOLOGIES AG·Filed 2005·Granted Oct 16, 2007·1 cites·26 claims
- 0560US6924234B2Method and apparatus for polishing a copper layer and method for forming a wiring structure using copperSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 2, 2005·6 cites·21 claims
- 0646US2006270228A1Method of forming metal pattern using selective electroplating processSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0746US2005148292A1Method and apparatus for polishing a copper layer and method for forming a wiring structure using copperSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 0839US2005070090A1Method of forming metal pattern using selective electroplating processSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →