Inventor · disambiguated record
Duckgyu Kim
Also filed as: KIM DUCKGYU
5 granted patents·8 pending applications·0 citations·filing 2020–2024
60Inventor score
Files withSAMSUNG ELECTRONICS CO LTD13
Top patents by PatentIndex Score
13 records- 0163US11756869B2Semiconductor package having UBM pad with gap separating central portion from peripheral portionSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·17 claims
- 0260US11276633B2Semiconductor package having UBM pad with gap separating central portion from peripheral portionSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 0360US2025357403A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0456US2025014953A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0555US2025192086A1Chip-on-film package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0655US2025167090A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0755US2025316549A1Semiconductor package and method for fabrication the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0854US11600556B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 0954US2025167054A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1053US2024321792A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1151US11682633B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 1250US11728261B2Chip on film package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 1349US2025309075A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →