Inventor · disambiguated record
Duanquan Liao
Also filed as: LIAO DUANQUAN
2 granted patents·1 pending application·0 citations·filing 2018–2020
21Inventor score
Technology areasH10P
Files withSHANGHAI HUALI INTEGRATED CIRCUIT CORP1SHANGHAI HUALI INTEGRATED CIRCUIT MFG CO LTD1SHANGHAI HUALI MICROELECT CORP1
Top patents by PatentIndex Score
3 records- 0137US11271012B1Method for improving size of contact holes of FDSOI deviceSHANGHAI HUALI INTEGRATED CIRCUIT CORP·Filed 2020·Granted Mar 8, 2022·0 cites·17 claims
- 0235US2019378910A1Semiconductor structure and manufacturing method for sameSHANGHAI HUALI INTEGRATED CIRCUIT MFG CO LTD·Filed 2018·Application pending·0 cites
- 0332US10497718B2Silicon-on-insulator structure having bipolar stress, and manufacturing method thereforSHANGHAI HUALI MICROELECT CORP·Filed 2018·Granted Dec 3, 2019·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →