Inventor · disambiguated record
Du Maohua
Also filed as: MAOHUA DU
1 granted patent·3 pending applications·5 citations·filing 2012–2014
26Inventor score
Top patents by PatentIndex Score
4 records- 0160US8766100B2Printed circuit board and semiconductor package using the sameYUAN QIU·Filed 2012·Granted Jul 1, 2014·5 cites·14 claims
- 0231US2014245131A1Mobile devices and methods of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 0329US2014319681A1Semiconductor package including solder ballSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 0427US2013299981A1Molding material, method of fabricating the same, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →