Inventor · disambiguated record
Dusko Paripovic
Also filed as: PARIPOVIC DUSKO
4 granted patents·4 pending applications·1 citations·filing 2015–2022
55Inventor score
Files withSIKA TECH AG8
Top patents by PatentIndex Score
8 records- 0172US11192995B2Heat expandable foam for low temperature cureSIKA TECH AG·Filed 2016·Granted Dec 7, 2021·1 cites·16 claims
- 0268US12460061B2Expandable material with improved thermal insulation properties and use thereofSIKA TECH AG·Filed 2021·Granted Nov 4, 2025·0 cites·25 claims
- 0356US2024059943A1Heat-curing epoxy resin composition suitable for pre-curing processes without additional metal joining techniquesSIKA TECH AG·Filed 2022·Application pending·0 cites
- 0444US2022403128A1Thermally expandable compositions comprising an endothermic blowing agentSIKA TECH AG·Filed 2020·Application pending·0 cites
- 0543US12173132B2Foam with improved expansion behaviour when used in thin layersSIKA TECH AG·Filed 2018·Granted Dec 24, 2024·0 cites·11 claims
- 0640US2019169392A1Thermoplastic foam with concomitant expansion and curingSIKA TECH AG·Filed 2017·Application pending·0 cites
- 0739US10752746B2Acoustical foam with improved performanceSIKA TECH AG·Filed 2015·Granted Aug 25, 2020·0 cites·14 claims
- 0836US2022242492A1System of a reinforced body elementSIKA TECH AG·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →