Inventor · disambiguated record
Dusan Postulka
Also filed as: POSTULKA DUSAN
0 granted patents·2 pending applications·0 citations·filing 2023–2024
Files withSEMICONDUCTOR COMPONENTS IND LLC2
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2 records- 0144US2025149377A1Structure and method of forming low-cost thick soi waferSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0240US2025259883A1Process of forming a thin semiconductor layer bonded to a processing substrate and an electronic device including the thin semiconductor layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →